2014-10-28

H/L ProLight Introduces 6W Venti 3535 Single Chip Package at 2014 Hong Kong Int’l Lighting Fair

Taiwan high power LED packaging house, ProLight Opto, have introduced Venti 3535 single chip package which can be driven up to 1.5A at 2014 Hong Kong Int’l Lighting Fair. Different to other LED packaging house’s preference to the flip chip technology, ProLight have developed its own high thermal dissipating eutectic technology, which allow standard LED chip to be able to drive to 1.5A and obtain highest lumen output.
Continue reading
Silanna UV, a global innovator in ultraviolet semiconductor technology, today announced the release of an additional package type: a TO-39 flat window package for its high-performance SF1 series (Far-UVC 235 nm) and SN3 series (Deep-UVC 255 nm) L... READ MORE

Ennostar, a leading vertically integrated optoelectronic semiconductor company, will showcase its latest Micro LED optical communication innovations at Touch Taiwan 2026, in collaboration with AUO Corporation and Tyntek Corporation. In additio... READ MORE