The Bergquist Company is proud to introduce its latest product in our Liqui-Bond® family – Liqui-Bond® EA 1805. Sporting a Thermal Conductivity of 1.8 W/m-K, our new Liqui-Bond® EA 1805 is a two-component, epoxy based, liquid dispensable adhesive that cures at room temperature with a high bond strength that can be accelerated with additional heat. Having a high bond strength eliminates the need for fasteners and maintains a structural bond even in severe environments.