2015-01-13

What are the Real COB, Flip Chip and Vapor Chamber Technology?

What is “Vapor Chamber” Vapor Chambers provide far superior thermal performance than traditional solid metal Heat spreaders at reduced weight and height. Thermal spread resistance is almost neglectable and thermal resistance is x times lower than (refer to copper, carbon nanotube compound, nano diamond compound). Vapor Chambers enable higher component heat densities and TDPs(Thermal Design Power) at safe operating temperatures, extending the components and products life.
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Veeco Instruments Inc. (NASDAQ: VECO), a global leader in compound semiconductor process equipment, today announced the first commercial acceptance and qualification of its LUMINA+ metal organic chemical vapor deposition (MOCVD) system by Enno... READ MORE

Absen will showcase a broad portfolio of LED display solutions at InfoComm 2026, highlighting technologies designed for enterprise, commercial, control room, rental and staging, sports, and virtual production applications. The company’s ... READ MORE