2015-01-13

What are the Real COB, Flip Chip and Vapor Chamber Technology?

What is “Vapor Chamber” Vapor Chambers provide far superior thermal performance than traditional solid metal Heat spreaders at reduced weight and height. Thermal spread resistance is almost neglectable and thermal resistance is x times lower than (refer to copper, carbon nanotube compound, nano diamond compound). Vapor Chambers enable higher component heat densities and TDPs(Thermal Design Power) at safe operating temperatures, extending the components and products life.
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The world’s attention turns to the game as the 2026 FIFA World Cup, jointly hosted by the United States, Canada, and Mexico, delivers one of the most anticipated sporting spectacles in history. Forty-eight national teams are competing ac... READ MORE

ViewSonic Corp., a leading global provider of visual and edtech solutions, announced that the company’s LDE Series of All-in-One Direct View LED Displays have been selected as the winner of the “Education Hardware Innovation Award&... READ MORE