2015-01-13

What are the Real COB, Flip Chip and Vapor Chamber Technology?

What is “Vapor Chamber” Vapor Chambers provide far superior thermal performance than traditional solid metal Heat spreaders at reduced weight and height. Thermal spread resistance is almost neglectable and thermal resistance is x times lower than (refer to copper, carbon nanotube compound, nano diamond compound). Vapor Chambers enable higher component heat densities and TDPs(Thermal Design Power) at safe operating temperatures, extending the components and products life.
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Whether it is a family summer holiday, a weekend trip with the camper or a long drive down south: for many people, the car remains the most popular means of transport for their vacation. To make sure the journey doesn’t end in a traffic ... READ MORE

Samsung Electronics has today announced it’s teamed up with Twickenham Film Studios (TFS) and award-winning Virtual Production (VP) experts Quite Brilliant (QB) that will see Samsung’s cutting-edge VP technology housed at Twickenha... READ MORE