2015-01-13

What are the Real COB, Flip Chip and Vapor Chamber Technology?

What is “Vapor Chamber” Vapor Chambers provide far superior thermal performance than traditional solid metal Heat spreaders at reduced weight and height. Thermal spread resistance is almost neglectable and thermal resistance is x times lower than (refer to copper, carbon nanotube compound, nano diamond compound). Vapor Chambers enable higher component heat densities and TDPs(Thermal Design Power) at safe operating temperatures, extending the components and products life.
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Based on the information announced in our timely disclosures dated January 29, 2026, entitled “Notice Regarding Acquisition of Shares of Iwasaki Electric Co., Ltd. (to Make It a Subsidiary),” and March 31, 2026, entitled “(Pr... READ MORE

Signify, the world leader in lighting, today announced it has entered FIBA Equipment & Venue Centre Approval Programme, one of the most recognized product quality programmes in the industry. Signify’s professional sports lighting sol... READ MORE