Cree, Inc. introduces the XLamp® XHP70.2 LED, the second generation of the highest output Extreme High Power LED, which delivers up to 9 percent more lumens and 18 percent higher lumens-per-watt (LPW) than the first generation XHP70 LED.

Panasonic Corporation today announced that it has developed a blue-violet semiconductor laser operating at output power of 4.5 W, which is 1.5 times higher than that of the conventional one even at 60ºC, the maximum operating temperature for lasers in general.　 It can also oscillate with the high energy conversion efficiency, which is 1.2 times higher than that of conventional lasers. This has been made possible by Panasonic’s unique double heat flow packaging technology that improves the heat dissipation. This newly-developed laser will help laser application systems, such as vehicle and industrial lighting as well as laser machining equipment, to be made smaller and consume less power.

Flip Chip Opto, a LED lighting technology company, announced its new P Series of LED Flip Chip Chip-on-Board (COB) products. These high-performance lighting modules are comprised of patented 3-Pad LED flip chips with a Pillar Metal Core Printed Circuit Board (P-MCPCB) to substantially reduce junction temperatures, thermal decay and light emitting surface (LES). Our innovation enables designers to enhance “Lumen-per-Dollar” performance by driving the modules at substantially higher currents reducing LED chip counts, heatsinks and optics.