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2015-12-04

Remtec Acquired by Precision Glass-to-Metal Seals Manufacturer LTI

Remtec, the leading manufacturer of ceramic substrates, packages and submounts using PCTF (Plated Copper on Thick Film) metallization, has been acquired by LTI (www.legacytechnologies.com), a major player in the field of precision glass-to-metal seals and glass-to-metal hermetic packages.
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2015-01-22

Remtec Expands Direct Bond Copper Product Offerings

Remtec, the leading manufacturer of substrates and packages using PCTF® (Plated Copper on Thick and Thin Film) metallization, has expanded its Direct Copper Bond (DBC) substrate capabilities. New capabilities include solid copper filled vias and copper bore coated holes providing front-to-back connections and thermal paths for better heat management as well as solder mask and assembly options.
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FEATURED PRODUCTS
[Product News] Nichia Starts Mass Production of Industry-Leading High Efficiency Deep UV (280nm) LEDs

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[Product News] Nichia Launches White LED "NS2W806H-B2" Featuring Blue/Green Chips

Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LED, is launching a white LED (Part No. NS2W806H-B2) designed for LCD backlighting. This product adds a new green chip in addition to the exist... READ MORE

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