2015-12-04

Remtec Acquired by Precision Glass-to-Metal Seals Manufacturer LTI

Remtec, the leading manufacturer of ceramic substrates, packages and submounts using PCTF (Plated Copper on Thick Film) metallization, has been acquired by LTI (www.legacytechnologies.com), a major player in the field of precision glass-to-metal seals and glass-to-metal hermetic packages.
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2015-01-22

Remtec Expands Direct Bond Copper Product Offerings

Remtec, the leading manufacturer of substrates and packages using PCTF® (Plated Copper on Thick and Thin Film) metallization, has expanded its Direct Copper Bond (DBC) substrate capabilities. New capabilities include solid copper filled vias and copper bore coated holes providing front-to-back connections and thermal paths for better heat management as well as solder mask and assembly options.
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Recently, OMINSU Vietnam signed a strategic agreement with Seoul Semiconductor, marking a pivotal turning point in elevating the “Made in Vietnam” LED lighting brand. At the signing ceremony, Vietnam’s OMINSU and Seoul Semicond... READ MORE
From June 19 to 22, 2025, Samsung Electronics will collaborate with globally renowned artists to celebrate global diversity, artistic innovation and the power of display technology at Art Basel in Basel 2025, the world’s largest art fair he... READ MORE