2015-12-04

Remtec Acquired by Precision Glass-to-Metal Seals Manufacturer LTI

Remtec, the leading manufacturer of ceramic substrates, packages and submounts using PCTF (Plated Copper on Thick Film) metallization, has been acquired by LTI (www.legacytechnologies.com), a major player in the field of precision glass-to-metal seals and glass-to-metal hermetic packages.
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2015-01-22

Remtec Expands Direct Bond Copper Product Offerings

Remtec, the leading manufacturer of substrates and packages using PCTF® (Plated Copper on Thick and Thin Film) metallization, has expanded its Direct Copper Bond (DBC) substrate capabilities. New capabilities include solid copper filled vias and copper bore coated holes providing front-to-back connections and thermal paths for better heat management as well as solder mask and assembly options.
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ams OSRAM, a global leader in intelligent sensor and emitter technologies, has filed a patent infringement complaint in the United States against Spider Farmer, a manufacturer of indoor farming luminaires, and has also taken further action bas... READ MORE

Recently, the world’s largest monolithic LED virtual production volume—jointly developed by Absen and Versatile Media—made a high-profile debut, drawing widespread attention across the industry and beyond. As a global leader ... READ MORE