2015-12-04

Remtec Acquired by Precision Glass-to-Metal Seals Manufacturer LTI

Remtec, the leading manufacturer of ceramic substrates, packages and submounts using PCTF (Plated Copper on Thick Film) metallization, has been acquired by LTI (www.legacytechnologies.com), a major player in the field of precision glass-to-metal seals and glass-to-metal hermetic packages.
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2015-01-22

Remtec Expands Direct Bond Copper Product Offerings

Remtec, the leading manufacturer of substrates and packages using PCTF® (Plated Copper on Thick and Thin Film) metallization, has expanded its Direct Copper Bond (DBC) substrate capabilities. New capabilities include solid copper filled vias and copper bore coated holes providing front-to-back connections and thermal paths for better heat management as well as solder mask and assembly options.
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With the rise of streaming services and endorsements from the Hollywood movie industry, an increasing number of movies, TV series, and documentary concert films are being produced using Virtual Production (VP) and Extended Reality (XR) technol... READ MORE

A tiny Chip LED from ams OSRAM offers higher brightness, making it simply ideal for integration into everyday devices such as in-ear headphones or smart rings The enhanced Chip LED from ams OSRAM delivers higher brightness—while taking u... READ MORE