2015-01-22

Remtec Expands Direct Bond Copper Product Offerings

Remtec, the leading manufacturer of substrates and packages using PCTF® (Plated Copper on Thick and Thin Film) metallization, has expanded its Direct Copper Bond (DBC) substrate capabilities. New capabilities include solid copper filled vias and copper bore coated holes providing front-to-back connections and thermal paths for better heat management as well as solder mask and assembly options.
Continue reading

Munich, Germany – Valeo, a global leader in automotive lighting, and Ennostar, a global leader in optoelectronic solutions, are collaborating on smart automotive exterior displays. Their first collaborative product is showcased at IAA Mo... READ MORE

The all-new Mercedes-Benz GLC: the highlights For many years, the GLC has been the most popular model from Mercedes-Benz, repeatedly topping the charts as the brand’s bestseller, worldwide. As was the case once again in the first half of... READ MORE