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2015-01-22

Remtec Expands Direct Bond Copper Product Offerings

Remtec, the leading manufacturer of substrates and packages using PCTF® (Plated Copper on Thick and Thin Film) metallization, has expanded its Direct Copper Bond (DBC) substrate capabilities. New capabilities include solid copper filled vias and copper bore coated holes providing front-to-back connections and thermal paths for better heat management as well as solder mask and assembly options.
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[Product News] Macroblock to Drive Advances: Captivate ISE 2025 with Groundbreaking Flagship DaVinci Series LED Driver ICs

ISE 2025, the largest European system integration trade show, marks a significant highlight for the LED display industry at the start of the year. Macroblock is excited to debut a new series of products and collaborate with industry leaders su... READ MORE

[News] ViewSonic Unveils Pioneering Control Box Designs for Seamless Large Display Adoption at ISE 2025

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