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2015-01-22

Remtec Expands Direct Bond Copper Product Offerings

Remtec, the leading manufacturer of substrates and packages using PCTF® (Plated Copper on Thick and Thin Film) metallization, has expanded its Direct Copper Bond (DBC) substrate capabilities. New capabilities include solid copper filled vias and copper bore coated holes providing front-to-back connections and thermal paths for better heat management as well as solder mask and assembly options.
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FEATURED PRODUCTS
Violumas Boosts 275nm and 265nm Output in Next Generation UVC LEDs

Violumas, provider of high-power UV LED solutions and inventor of 3-PAD LED technology, is proud to launch the release of new 275nm and 265nm LEDs in mid-power, high-power, and high-density packages. The radiant flux of the new 275nm and 265nm... READ MORE

Cree LED Introduces CV28D LEDs with Groundbreaking FusionBeam Technology for LED Signs and Displays

DURHAM, NC – November 12, 2024 –– Cree LED, a Penguin Solutions brand (Nasdaq: PENG), today announced the launch of its new CV28D LEDs with FusionBeam™ Technology, a groundbreaking advancement for the LED signage market... READ MORE

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