2015-01-22

Remtec Expands Direct Bond Copper Product Offerings

Remtec, the leading manufacturer of substrates and packages using PCTF® (Plated Copper on Thick and Thin Film) metallization, has expanded its Direct Copper Bond (DBC) substrate capabilities. New capabilities include solid copper filled vias and copper bore coated holes providing front-to-back connections and thermal paths for better heat management as well as solder mask and assembly options.
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ams OSRAM, global leader in innovative light and sensor solutions, announced today that its OSIRE™ E3731i intelligent RGB LED, based on the Open System Protocol (OSP), has been successfully integrated into the NIO ES9 — NIO’s... READ MORE