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2015-01-22

Remtec Expands Direct Bond Copper Product Offerings

Remtec, the leading manufacturer of substrates and packages using PCTF® (Plated Copper on Thick and Thin Film) metallization, has expanded its Direct Copper Bond (DBC) substrate capabilities. New capabilities include solid copper filled vias and copper bore coated holes providing front-to-back connections and thermal paths for better heat management as well as solder mask and assembly options.
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[News] Philips Skylight, Designed to Bring the Feeling of Daylight Indoors

Signify, the world leader in lighting, announces Philips Skylight, a new ceiling lighting range designed to recreate the feeling of daylight indoors. Inspired by the natural brightness, depth and rhythm of sunlight, Philips Skylight combines a... READ MORE

[News] Philips Hue Expands Smart Home Lighting Portfolio with New Wired Switches, Play Lamps and Next-Generation Candle Bulbs

Signify, the world leader in lighting, today announced a new range Philips Hue smart lighting innovations, designed to give users more ways to personalize and control lighting throughout their homes. The latest additions include wired switches... READ MORE

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