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2015-01-22

Remtec Expands Direct Bond Copper Product Offerings

Remtec, the leading manufacturer of substrates and packages using PCTF® (Plated Copper on Thick and Thin Film) metallization, has expanded its Direct Copper Bond (DBC) substrate capabilities. New capabilities include solid copper filled vias and copper bore coated holes providing front-to-back connections and thermal paths for better heat management as well as solder mask and assembly options.
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[News] Cree LED and Promier Products, Inc. (d/b/a LitezAll) Resolve Patent Dispute Through Limited License Agreement

Cree LED®, a Penguin Solutions brand (Nasdaq: PENG), and Promier Products, Inc. today announced that they have reached a mutually beneficial settlement resolving a patent infringement dispute involving Cree LED’s patents related to L... READ MORE

[News] Nichia Presents Advanced Automotive Lighting Technologies at SIA Vision 2026

Nichia, a global leader in LED and laser diode technology, will present a broad portfolio of automotive technologies at SIA VISION 2026, taking place on September 23–24 at Les Pyramides in Le Port-Marly, France. On Stand 36, Nichia plans... READ MORE

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