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2015-01-22

Remtec Expands Direct Bond Copper Product Offerings

Remtec, the leading manufacturer of substrates and packages using PCTF® (Plated Copper on Thick and Thin Film) metallization, has expanded its Direct Copper Bond (DBC) substrate capabilities. New capabilities include solid copper filled vias and copper bore coated holes providing front-to-back connections and thermal paths for better heat management as well as solder mask and assembly options.
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[News] ams OSRAM Showcases Blue Laser Innovations at Laser World of Photonics China 2026

ams OSRAM, a global leader in innovative light and sensor solutions today announced at Laser World of Photonics China (LWPC) 2026 a portfolio of laser products powered by its latest blue multi-mode laser chips. The company also presented, for ... READ MORE

[News] EVIYOS HD25 Sets New Standards in Compact Vehicle Safety and Communication

The introduction of the new Audi Q3 marks significant technological progress in how digital lighting systems are integrated into the Audi compact segment. EVIYOS HD25 is an advanced, pixel-based lighting solution developed by ams OSRAM. It is ... READ MORE

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