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2015-01-22

Remtec Expands Direct Bond Copper Product Offerings

Remtec, the leading manufacturer of substrates and packages using PCTF® (Plated Copper on Thick and Thin Film) metallization, has expanded its Direct Copper Bond (DBC) substrate capabilities. New capabilities include solid copper filled vias and copper bore coated holes providing front-to-back connections and thermal paths for better heat management as well as solder mask and assembly options.
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[News] Advancements in High-power UV-LED Technology Allow Mercury-free UV-LED Water Sterilization Equipment to Achieve an Industry-leading High Treated Water Flow Rate*1 of 10 m3 /h

Industrial boiler manufacturer MIURA CO., LTD. (Tokyo Head Office: Minato-ku, Tokyo; President and CEO: Tsuyoshi Yoneda; hereinafter referred to as “MIURA”) began sales of mercury-free UV-LED water sterilization equipment using UV-... READ MORE

[News] Dasen's Imager B100 Sets New Brightness Record

Dasen Lighting is proud to introduce the IMAGER B100 moving head light. The IMAGER series inherits Dasen's decades of technological innovation and demonstrates Dasen's commitment to redefining creative boundaries and creating scene-dri... READ MORE

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