2015-05-06

Samsung Electronics Unveils Ultra-Compact LED Chip Scale Packaging Technology at LIGHTFAIR International 2015

Samsung Electronics, a world leader in advanced component solutions, today introduced advanced chip scale packaging (CSP) technology for use in a diversity of LED lighting applications at LIGHTFAIR International 2015, being held in New York, May 5-7.
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2015-05-05

Samsung Outlines Approach for Smart Lighting at LIGHTFAIR International 2015

Samsung Electronics Co. Ltd., announced today that it will demonstrate for the first time, the company's new open, secure, and connected platform for smart lighting at LIGHTFAIR International 2015, being held in New York, May 5-7.
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2015-02-25

LIGHTFAIR® International 2015 Celebrates the International Year of Light

Lighting and design professionals from around the world will converge for networking opportunities, presentations by industry thought-leaders and event experiences at LIGHTFAIR® International (LFI®)—the world’s largest annual architectural and commercial lighting trade show and conference.  LFI takes place May 3-7 at New York’s Javits Center (Pre-Conference LIGHTFAIR Institute®: May 3-4; Trade Show & Conference: May 5-7).
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LEDVANCE is proud to announce that three of its most innovative lighting solutions have won recognition in the 2025 Illuminating Engineering Society (IES) Progress Report, a prestigious annual showcase of advancements in lighting technology. T... READ MORE

XLamp® CTW LEDs bring lighting flexibility to life New XLamp® CTW Series – Two-Channel CCT-Tunable White COB LEDs Cree LED’s XLamp CTW Series redefines CCT-tunable COB LEDs with unmatched lumen density, efficiency and de... READ MORE