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2015-05-06

Samsung Electronics Unveils Ultra-Compact LED Chip Scale Packaging Technology at LIGHTFAIR International 2015

Samsung Electronics, a world leader in advanced component solutions, today introduced advanced chip scale packaging (CSP) technology for use in a diversity of LED lighting applications at LIGHTFAIR International 2015, being held in New York, May 5-7.
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2015-05-05

Samsung Outlines Approach for Smart Lighting at LIGHTFAIR International 2015

Samsung Electronics Co. Ltd., announced today that it will demonstrate for the first time, the company's new open, secure, and connected platform for smart lighting at LIGHTFAIR International 2015, being held in New York, May 5-7.
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2015-02-25

LIGHTFAIR® International 2015 Celebrates the International Year of Light

Lighting and design professionals from around the world will converge for networking opportunities, presentations by industry thought-leaders and event experiences at LIGHTFAIR® International (LFI®)—the world’s largest annual architectural and commercial lighting trade show and conference.  LFI takes place May 3-7 at New York’s Javits Center (Pre-Conference LIGHTFAIR Institute®: May 3-4; Trade Show & Conference: May 5-7).
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FEATURED PRODUCTS
[News] 3Particle Joins Forces with Shineon Hardtech, Macroblock, and Brompton to Launch XyperReal Stage, Asia Premium Virtual Production Research & Innovation Centre

With the rise of streaming services and endorsements from the Hollywood movie industry, an increasing number of movies, TV series, and documentary concert films are being produced using Virtual Production (VP) and Extended Reality (XR) technol... READ MORE

[News] Ultra-compact Chip LED to enable more precise heart rate measurement in in-ear devices

A tiny Chip LED from ams OSRAM offers higher brightness, making it simply ideal for integration into everyday devices such as in-ear headphones or smart rings The enhanced Chip LED from ams OSRAM delivers higher brightness—while taking u... READ MORE

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