2015-06-10

Samsung Introduces COB LED Packages with Small LES and Advanced Color Quality

Samsung Electronics, a world leader in advanced component solutions, today introduced new chip-on-board (COB) LED package lineups, including small LES (light-emitting surface) COB packages, high CRI (color rendering index) COBs, and vivid COBs. The new COB packages with their outstanding color quality and scaled-down light emitting space, will provide a major design alternative for LED lighting makers.
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A jointly developed demonstrator from ams OSRAM and DP Patterning points to where automotive lighting networks are heading: single-layer flexible printed circuit boards (FPCBs) instead of complex multilayer designs — and, in the structur... READ MORE

ams OSRAM, a global leader in lighting and sensing innovation, announced that its next-generation HDR flicker detection sensor has been integrated into the newly released Honor Magic 8 flagship series. Featuring ultra-high sensitivity, precisi... READ MORE