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Home > LES
2015-06-10

Samsung Introduces COB LED Packages with Small LES and Advanced Color Quality

Samsung Electronics, a world leader in advanced component solutions, today introduced new chip-on-board (COB) LED package lineups, including small LES (light-emitting surface) COB packages, high CRI (color rendering index) COBs, and vivid COBs. The new COB packages with their outstanding color quality and scaled-down light emitting space, will provide a major design alternative for LED lighting makers.
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[News] ams OSRAM Files Patent Infringement Complaint Against Spider Farmer – Focus on Protecting Horticulture LED Innovations

ams OSRAM, a global leader in intelligent sensor and emitter technologies, has filed a patent infringement complaint in the United States against Spider Farmer, a manufacturer of indoor farming luminaires, and has also taken further action bas... READ MORE

[News] Accelerating the Industrialization of Film Production: Unveil the Technical Achievements Behind the World’s Largest LED Virtual Production Volume

Recently, the world’s largest monolithic LED virtual production volume—jointly developed by Absen and Versatile Media—made a high-profile debut, drawing widespread attention across the industry and beyond. As a global leader ... READ MORE

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