2015-06-10

Samsung Introduces COB LED Packages with Small LES and Advanced Color Quality

Samsung Electronics, a world leader in advanced component solutions, today introduced new chip-on-board (COB) LED package lineups, including small LES (light-emitting surface) COB packages, high CRI (color rendering index) COBs, and vivid COBs. The new COB packages with their outstanding color quality and scaled-down light emitting space, will provide a major design alternative for LED lighting makers.
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Silanna UV is pleased to announce the release of its next generation Far UVC LED, the SF2-3T9B5L1-TB, which exceeds even the popular SF1 series, with UVC wavelengths down to 230nm (typical 233nm); doubled output power; and 2x improvement in te... READ MORE

As automotive design continues to evolve, the demand for sleek, distinctive front lighting has never been greater. Thin, continuous light lines are becoming a defining element of vehicle identity, balancing aesthetics with functionality. In re... READ MORE