2015-06-19

Cosmoled and Dangoo Obtain Core IP for Filament LED

Over the past 2 years, a new type of LED packaging often referred to as “filament” LEDs has been gaining popularity fast. These LED packages enable the manufacturing of incandescent style LED bulbs, combining the traditional look and feel of the well-known incandescent bulbs with the user benefits of LED lighting such as extended life and energy savings. These types of lamps are expected to take the market by storm as mass retailers all over the world will be introducing these lamps in the coming lighting season.  LED Filaments are usually construc...
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Silanna UV, a global innovator in ultraviolet semiconductor technology, today announced the release of an additional package type: a TO-39 flat window package for its high-performance SF1 series (Far-UVC 235 nm) and SN3 series (Deep-UVC 255 nm) L... READ MORE

Ennostar, a leading vertically integrated optoelectronic semiconductor company, will showcase its latest Micro LED optical communication innovations at Touch Taiwan 2026, in collaboration with AUO Corporation and Tyntek Corporation. In additio... READ MORE