2016-06-21

OnChip Provides Semiconductor Wafer Backside Metallization

OnChip’s advanced wafer fabrication facility offers backside metallization (BSM) of thin films for various applications such as military, medical, and instrumentation. Back-metal is required on a wide range of Semiconductors devices to form a solderable die attach metal stack to ensure good electrical contact to the chip (ohmic contact) or proper bonding of the chips to their mounting cases. Power devices such as High Brightness Light Emitting Diodes (HB LED) require backside metal for an improved and reliable thermal conductivity. These metal layers are deposited using RF or DC sputtering and electron beam evaporation.
Continue reading

Strawberries flourish in a Controlled-Environment Agriculture Installation with Horticulture LED lighting provided by Cree LED and RED Horticulture. (Photo courtesy of RED Horticulture) The integration of technology into every aspect of life i... READ MORE

The prior blog titled “Nichia’s contribution to a realization of a mercury-free society” took a short break. However, there was a release about new LED-based water disinfection devices made by Miura Co., Ltd., a Japanese manu... READ MORE