In order to improve the performance of mobile phone camera, Germany-based semiconductor solution provider Infineon announced that it has enhanced its REAL3™ image sensor based on Time-of-Flight (ToF). Infineon is presenting the product at Mobile World Congress 2019 which is taking place in Barcelona from February 25 to 28. The 3D ToF single chip is designed to meet the requirements of the mobile consumer device market and demand for higher resolutions with small lenses. The chip can be applied in user authentication like face or hand recognition. In addition, ...

ams, the Austria-based Apple supplier, has announced the release of its new sensing component which can measure ambient light from behind an OLED screen. The newly launched RGB light and IR proximity sensor IC, TCS3701, is featured with behind-screen light measuring ability. The capability supports today’s industrial design trend to maximize smartphone display area by eliminating front-facing bezels, where an ambient light/proximity sensor is typically located. With the new sensor, the next iPhone could be notch-free. (Image: ams) According to ams, it has...

Osram announced that it is providing several of its components for automotive lighting and biometric identification solutions for microSNAP, Rinspeed’s concept vehicle, which will be presented at CES 2019. Rinspeed’s microSNAP is the latest version of the company’s autonomous concept car which has a chassis to contain the drivetrain and most of the IT while connecting to various body types. (Image: Osram) Outside the vehicle, microSNAP uses Osram’s Eviyos, a hybrid LED for smart headlights, which contains individually controlled pi...

Led by inventor and entrepreneur David Hall, Velodyne LiDAR announced a significant cost reduction for its VLP-16 Puck, which will spur hope and excitement for the development of safe autonomous vehicles that are accessible to all. Velodyne’s most popular LiDAR sensor, the VLP-16, is now offered to customers around the world for up to a 50 percent cost reduction.

AVX Corporation today announced that it has signed a definitive agreement to acquire the Transportation, Sensing & Control division (hereinafter called TS&C), from the UK company, TT Electronics PLC.