In order to improve the performance of mobile phone camera, Germany-based semiconductor solution provider Infineon announced that it has enhanced its REAL3™ image sensor based on Time-of-Flight (ToF). Infineon is presenting the product at Mobile World Congress 2019 which is taking place in Barcelona from February 25 to 28.

The 3D ToF single chip is designed to meet the requirements of the mobile consumer device market and demand for higher resolutions with small lenses. The chip can be applied in user authentication like face or hand recognition. In addition, it enhances augmented reality, morphing and photo effects and can be used to scan a room.

(Image: Infineon)

The sensor is featured with small size (4.6 x 5 mm), 150 k (448 x 336) pixel output and higher resolution compared with most existing ToF solution. It is also strong with its outdoor performance as the pixel array is sensitive to 940 nm infrared light.

Philipp von Schierstaedt, Vice President and the head of Infineon’s RF & Sensors business, said, “With the new image sensor generation, Infineon can further extend its leading position. Every device manufacturer can increase the value of their devices with the new REAL3 chip, while customizing the design and speeding up time to market”.