2021-09-03

Infineon And Panasonic Accelerate GaN Technology Development For 650 V GaN Power Devices

Munich, Germany and Osaka, Japan – 2 September 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Panasonic Corporation have signed an agreement for the joint development and production of the second generation (Gen2) of their proven gallium nitride (GaN) technology, offering higher efficiency and power density levels. The outstanding performance and reliability combined with the capability of 8-inch GaN-on-Si wafer production mark Infineon’s strategic outreach to the growing demand for GaN power semiconductors. In ...
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2021-07-23

ICL88xx Family Of Single-Stage Flyback Controllers With Constant Voltage Output Optimized For Cost-Effective Smart LED Drivers

Munich, Germany – 21 July 2021 – Cost-effective dimmable and intelligent LED systems are expected to increase the market share disproportionately in the coming years. Introducing the ICL8800, ICL8810 and ICL8820 single-stage flyback LED controllers for constant output voltages, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) addresses the need of LED driver manufacturers in this regard. With their unique features, the ICs meet the necessary performance requirements for LED lighting ap...
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2021-06-25

Infineon and Pmdtechnologies Partner with ArcSoft for Under-display Time-of-Flight Turnkey Solution

Munich, Germany – 23 June 2021 – The latest phone designs focus on solutions that allow a full-screen display and avoid the notch, punch-hole cameras, or bezels without compromising on quality or performance. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) together with its Time-of-Flight (ToF) partner pmdtechnologies and the leading vision-based imaging specialist ArcSoft is developing a turnkey solution that allows a ToF camera to work under the display of commercial smartphones. It will provide reliable high-quality infrared images and 3D d...
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2021-05-31

Osram and Infineon jointly boost NFC programming for extended flexibility in LED luminaires configuration

Joint press release of Osram GmbH and Infineon Technologies AG Munich, Germany – 27 May 2021 – Reduced complexity together with increased functionality and efficiency are dominating the agenda of all lighting manufacturers. In this regard, Osram and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY)  now join forces to enable Near Field Communication (NFC) programming for the industry. Osram’s new OPTOTRONIC ® FIT product family features Infineon’s NLM0011 and NLM0010 dual-mode NF...
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2021-05-28

APEC 2021: Infineon Showcases Industry’s Broadest Range of Power Solutions From Silicon to Wide Bandgap

San Jose, California – 26 May, 2021 – Building on decades of experience as a power leader, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will highlight the industry’s broadest range of power management solutions during the 2021 APEC Virtual Conference and Exposition from 14-17 June. With a device portfolio that spans silicon and wide bandgap (WBG) devices, engineers look to Infineon for solutions that balance performance, efficiency, reliability and cost. Infineon’s power solutions set the pace for innovations that...
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2021-05-12

Infineon increases supply security for silicon carbide by expanding the supplier base

source: Infineon Munich, Germany – 6 May 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has concluded a supply contract with the Japanese wafer manufacturer Showa Denko K.K. for an extensive range of silicon carbide material (SiC) including epitaxy. The German semiconductor manufacturer has thus secured more base material for the growing demand for SiC-based products. SiC enables highly efficient and robust power semiconductors that are used in particular in the fields of photovoltaic, industrial power supply, and charging ...
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2020-12-03

CoolSiC™ CIPOS™ Maxi: World's first 1200 V transfer molded IPM with SiC

Munich, Germany – 2 December 2020 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched a 1200 V transfer molded silicon carbide (SiC) integrated power module (IPM) and concludes the massive roll-out of SiC solutions for this year. The CIPOS™ Maxi IPM IM828 series is the industry’s first in this voltage class. The series provides a compact inverter solution with an excellent thermal conduction and a wide range of switching speed for three-phase AC motors and permanent magnet motors in variable speed drive ap...
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2020-07-28

Infineon Launches Radar-based Solution to Secure Social Distancing

Infineon reported its development of a smart entrance counter solution which can help public places to manage people flow and maintain safe social distancing to support slowing down the COVID-19 spread. The Smart entrance counter solution is a miniaturized, discrete radar board (250 mm x 150 mm) that accurately and anonymously counts people with one single 60 GHz radar sensor and integrated software. A traffic light system informs about if an entry is allowed or not. (Image: Infineon) “We aimed at quickly creating an effective solution that allows everyone of us ...
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2020-03-27

COVID-19 Impacts: Signify Suspends and Infineon Withdraws Fiscal 2020 Outlook

More companies published their response to the impacts resulted by coronavirus pandemic. Signify announced several measures of the company including suspending its fiscal 2020 outlook postponing Capital Market Day. Infineon Technologies reported withdrawal of its business outlook of fiscal 2020. (Image: Pixabay) Signify said that it has taken considerable action focused on the health and safety of its employees, on customer engagement and supply chain continuity and on free cash flow generation and operating expenses. The company also decided to suspend its financial outlook...
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2020-01-31

【AUTOMOTIVE WORLD】Driver IC and Compound Semiconductor Technology Overview

One of the major focuses at AUTOMOTIVE WORLD 2020 was driver IC, who plays a critical role for automotive lighting technology. Driver IC companies across the world came to the event with their novel technology and components to simplify current management, improve the flexibility of light design and increase applications. Rohm released a new four channel LED driver BD18337EFV-M, which its thermal dispersion outputs can be controlled by one pin to reduce component and installation area. The driver can be applied in rear lights including brake lights and tail...
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2020-01-08

Infineon Presents the World’s Smallest 3D Image Sensor for Mobile Devices at CES 2020

Infineon Technologies has collaborated with software and 3D Time of Flight (ToF) system specialist pmdtechnologies to develop the world’s smallest 3D image sensor, and is presenting it at CES 2020 in Las Vegas. The new REAL3™ single-chip solution measures 4.4 x 5.1 mm, allowing it to be incorporated into small size devices to provide high resolution data with low power consumption. (Image: Infineon) “With the fifth generation of our REAL3™ chip we are once again demonstrating our leading position in the field of 3D sensors,” sa...
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2019-10-17

Infineon Radar Technology and ams VCSEL Support Gesture Control and Face Unlock for Google Pixel 4

Google launched its latest smart phones Pixel 4 and Pixel 4 XL on October 15, featuring advanced camera functions, motion sensing and face unlock. The new features of Pixel 4 are supported by sensing technology specialists including Infineon and ams. (Image: Google) Google created Motion Sense to detect users hand motions based on its technology from Project Soli. The technology allows user operate the device simply by swiping or waving hands in front of it Instead of touching or holding the phone. This function was achieved thanks to Infineon’s radar chip. T...
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2019-09-20

Nichia Partners Infineon to Create Micro LED Automotive Lights with Adaptive Driving Beams

With Nichia’s LED and driver IC from Infineon, advanced automotive front light with Micro LED enables safer driving and innovative application. The two companies announced that they have started the development of a high-definition (HD) light engine with more than 16,000 Micro LEDs for front light applications. According to Nichia, the Micro LED-based matrix light will offer a resolution about 180 times higher compared to current front light solution, paving the way for improved safety features. For example, HD light can be used to warn the driver of haza...
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2019-03-12

Infineon Introduces LED Driver for Smart Connections

The emerging trend of smart lighting and Internet of Things, requires a new generation of LED drivers. Infineon Technologies introduces the new member of its XDP™ LED series, the XDPL8221 for cost-effective dual-stage drivers with advanced features. This device combines a quasi-resonant PFC and a quasi-resonant flyback controller with primary side regulation together with a communication interface. A comprehensive set of configurable protection mechanisms (standard and sophisticated) ensure safe, reliable and robust LED driver for a large set of use cases. Th...
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2019-02-27

Infineon Partners LG to Introduce ToF Camera in LG’s New Smartphone

German semiconductor maker Infineon announced that it has teamed up with LG Electronics to introduce Time-of-Flight (ToF) technology adopted front-facing camera on the latest smartphone of LG which will be revealed at Mobile World Congress 2019 in Barcelona. Infineon has provided its REAL3™ image sensor chip to LG’s upcoming G8 ThinQ. With Infineon’s pmdtechnologies in algorithms for processed 3D point clouds (a set of data points in space produced by 3D scanning), the innovative sensor will deliver a new level of front camera capability in a...
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2019-02-26

Infineon Presents ToF Image Sensor for High Quality Photo at MWC 2019

In order to improve the performance of mobile phone camera, Germany-based semiconductor solution provider Infineon announced that it has enhanced its REAL3™ image sensor based on Time-of-Flight (ToF). Infineon is presenting the product at Mobile World Congress 2019 which is taking place in Barcelona from February 25 to 28. The 3D ToF single chip is designed to meet the requirements of the mobile consumer device market and demand for higher resolutions with small lenses. The chip can be applied in user authentication like face or hand recognition. In addition, ...
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2018-11-19

Infineon Acquires SiC Wafer Technology Startup Siltectra

Infineon Technologies has announced the acquisition of Siltectra, a Dresden-based start-up which developed an innovative technology, named Cold Split, for processing crystal material. The company was acquired for EUR 124 million (US$141.38 million). With the acquisition, Infineon aims to adopt Cold Split technology to split silicon carbide (SiC) wafers, doubling the number of chips out of one wafer. “This acquisition will help us expand our excellent portfolio with the new material silicon carbide as well. Our system understanding and our unique know how on thin ...
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2018-03-07

Cree Acquires Infineon RF Power Business for € 345 Million

Cree, Inc. has acquired assets of Infineon Technologies AG Radio Frequency (RF) Power Business for approximately € 345 million. The transaction expands the Cree Wolfspeed business unit’s wireless market opportunity.
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2018-02-27

Cree Announces Long-Term Silicon Carbide Wafer Supply Agreement with Infineon

Cree announces that it signed a strategic long-term agreement to produce and supply its Wolfspeed silicon carbide (SiC) wafers to Infineon Technologies AG
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2018-01-08

3D Image Sensor: Infineon Enables Easy Smartphone Unlock by Face Recognition

One megatrend feature in mobile communications is to unlock smartphones by 3D face recognition instead of fingerprint or PIN. Making authentication more convenient and more secure, it may soon become indispensable for mobile payment applications and mobile ID. With the 3D image sensor chip from Infineon Technologies the unlock-with-your-face feature becomes smarter, faster and more reliable.
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2018-01-03

LEDinside: Most-Mentioned Companies You Will Hear When Speaking of 3D Sensing

2018 just began but we already knew before that new technologies such as 3D sensing are going to be huge this year after the launch of Apple’s iPhone X last September. Using faces to unlock phones and personalize expressive Animojis are probably the two most memorable features that make 3D sensing widely known of among consumers. Surely, other phone makers will not let go of a chance to sport their products with similar capabilities, hence we learn the projection that the total value of the global market of mobile 3D Sensing is anticipated to grow at a CAGR of 209% from USD 1.5 billion in 2017 to USD 14 billion by 2020.
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2017-05-18

Infineon Starts Volume Production of First Full-SiC-Module

Higher efficiency, increased power density, smaller footprints and reduced system costs: these are the main advantages of transistors based on silicon carbide (SiC). Infineon Technologies AG is starting volume production for the EASY 1B, the first full-SiC module announced during PCIM 2016. On the occasion of this year’s PCIM in Nuremberg, the company is showcasing additional module platforms and topologies for the 1200 V CoolSiC™ MOSFET family. Infineon is now able to bring the potential of SiC technology to a new level.
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2017-05-15

From Payment to Ticketing: Contactless Technologies Are On the Rise in Smart Cities

Contactless card and touch-and-go mobile technology payments are on the rise: especially consumers and commuters in highly populated urban areas require higher transaction speeds and more convenience. Infineon Technologies AG, a major provider of chip-based payment products, helps card and device manufacturers and transport operators to cope with the security and performance challenges of this trend.
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2017-05-05

Infineon Q2 Operating Profit Slightly Below Expectations, But Full-Year Guidance Unchanged

Infineon Technologies AG has reported results for Q2 2017 (period ended 31 March 2017) with revenue up 7% to €1,767 million quarter-on-quarter. Opera­ting profit excluding special items increased to 296 million Euros ($322 million) in the quarter, which slightly missed the average forecast for 299 million Euros, according to Reuters.
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2017-03-28

Light Intelligence for Everyone: Research on Lighting Systems of the Future

Nearly 20 percent of all the electricity consumed in the world is for lighting. And about 80 percent of that lighting is attributed to professional applications such as building, office, industry or street lighting, and about 20 percent to private residential lighting. 
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2017-03-01

An Intelligent Streetlight for the City of the Future: Infineon Teams Up With Eluminocity

The trend towards urbanization is continuing and it is projected that by 2050 nearly 70 percent of mankind will reside in urban areas. Such demographic changes will impact on a city’s infrastructure, driving requirements for smarter, more secure and energy-efficient solutions. Infineon Technologies AG and eluminocity GmbH have jointly developed an intelligent streetlight to tackle these requirements. In promoting e-mobility, helping to save energy and enabling a connected infrastructure, the streetlight can serve as the backbone for the city of the future.
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2017-02-17

Cree Announces Termination of Wolfspeed and Infineon Sale Transaction

Cree today announced that it will terminate the definitive agreement to sell its Wolfspeed Power and RF division (“Wolfspeed”), which includes the silicon carbide substrate business for power, RF and gemstone applications, to Infineon Technologies AG.
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2017-01-11

Infineon Launches New Lineup of LED Drivers for Compact Automotive LED Front Lighting Applications

LEDs in automotive front lighting enable energy savings, new light designs and applications such as matrix beam and laser high-beam. Supporting the progress in automotive lighting Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launched high-power LED driversspecifically designed for automotive front lights. The drivers are available within the new LITIX Power Flex series and the LITIX Power series. They address flexible DC/DC driver solutions supporting LED systems of up to 50 W and even above. Application setups can vary: many medium-power LEDs with string voltages of up to 55 V or few LEDs with high currents of up to 3 A and more.
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2016-10-13

Infineon Buys Innoluce BV for Automated Driving Applications

Microelectronics from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is a key technology for automated and connected driving. As leading chip provider for driver assistance systems, Infineon continues its innovation path and has acquired 100 percent of Innoluce BV, a fabless semiconductor company headquartered in Nijmegen. Based on the know-how of Innoluce, Infineon will develop chip components for high-performance lidar systems. Both companies agreed on confidentiality on the terms.
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2016-09-20

Infineon Launches Flicker Free Control IC LED Driver

Modern LED technology offers many advanced possibilities for lighting applications. With the XDPL8220, Infineon Technologies extends its product portfolio of digital and configurable LED driver ICs. The IC enables the lighting industry to realize essential features for smart lighting and increases the benefits for both, end user and manufacturers. The primary side control of this device saves extra components, reducing cost on the one hand and increasing reliability on the other.
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With up to 2000lm per LED, LUXEON 7070 delivers the power, efficacy and solution cost reductions luminaire manufacturers need   San Jose, CA – August 31, 2021 – More lumens, higher efficacy, and lower system costs are the... READ MORE

 - Osconiq E 2835 CRI 90 (QD) expands ams OSRAM's portfolio of lighting solutions that provide very high quality in a new mid-power LED. - In-house Quantum Dot technology ensures outstanding efficiency values of over 200 lm/W, even at... READ MORE