2019-02-27
A Micro LED equipped with 5G connection was showcased at MWC this year by the Fibocom International Alliance (FIA), an organization focuses on 5G IoT devices established by Chinese wireless communication specialist, Fibocom. According to FIA, the 5G Micro LED display, named FIA One, combines the two attention-drawing technologies and integrates existing access devices such as gateways, routers, set-top boxes, or IP TV services into a single display. FIA said the integration opens a door for new digital experiences and IoT innovations. "W...
Continue reading →
2019-02-26
In order to improve the performance of mobile phone camera, Germany-based semiconductor solution provider Infineon announced that it has enhanced its REAL3™ image sensor based on Time-of-Flight (ToF). Infineon is presenting the product at Mobile World Congress 2019 which is taking place in Barcelona from February 25 to 28.
The 3D ToF single chip is designed to meet the requirements of the mobile consumer device market and demand for higher resolutions with small lenses. The chip can be applied in user authentication like face or hand recognition. In addition, ...
Continue reading →