Analog Devices announced a strategic collaboration with Microsoft to leverage Microsoft’s 3D time-of-flight (ToF) sensor technology, allowing customers to easily create 3D applications that bring higher degrees of depth accuracy and work regardless of the environmental conditions in the scene. ADI’s technical expertise will build upon Microsoft Azure Kinect technology to deliver leading ToF solutions to a much broader audience in areas such as Industry 4.0, automotive, gaming, augmented reality, computational photography and videography. Currently, the indu...

STMicroelectronics announced that its FlightSense Time-of-Flight (ToF) technology has been adopted by Aura Aware, a Dutch startup company to develop a social distance maintaining device for preventing disease transmission. Time-of-Flight sensors transmit photons and then calculate distance to the target based on the time it takes for the reflected photons to be received back by the sensor. Moreover, ranging accuracy is unaffected by surface characteristics of the target, such as clothing color or skin reflectivity, of the target, making FlightSense ideal for helping peopl...

STMicroelectronics announced the extension of its FlightSense ToF ranging sensors by introducing the VL53L3CX which allow measuring distances to multiple objects and increasing accuracy. Meanwhile, the company also introduced a reference design suited for monitoring social distancing and assuring remote operation to protect human health in all environments in response to global or local pandemic conditions. The ToF sensor VL53L3CX measures object ranges from 2.5 cm to 3 m, allowing designers to introduce features like occupancy detectors or reporting the exact distanc...

Osram revealed an intelligent emitter module for 3D sensing which allows smartphones to take high-quality images and videos with staggered depth of field. Besides optimizing image content, the module can also be used for 3D object recognition or AR applications. The product is designed to strengthen camera function of smartphones. Innovative functionalities of mobile devices require components to fit into ever smaller spaces. A central task for manufacturers has been to find the right emitters, photodiodes and VCSEL driver chips (ICs), then calibrate them and finally insta...

Sensor solution provider AMS debuted a new IR flood illuminator module, Merano Hybrid, which integrates the laser emitter, laser driver, optical stack and eye-safety monitoring to enhance 3D sensing capabilities for mobile products. (Image: AMS) The highly power-efficient 2W Merano-Hybrid is suitable for use in the latest 3D sensing technologies, including the Time-of-Flight and Structured Light methods. Applications such as face recognition, augmented reality, 3D object scanning and 3D image rendering, as well as other industrial and automotive applications, w...

Analog Devices, Inc. (ADI) announced a collaboration with Jungo to develop a Time-of-Flight (ToF) and 2D infrared- (IR) based camera solution to enable driver- and in-cabin monitoring in vehicles. (Image: ADI) The combination of ADI’s ToF technology with Jungo’s Codriver software is expected to enable the monitoring of vehicle occupants for levels of drowsiness and distraction by observing head and body position as well as eye gaze. The solution is also expected to enable smart vehicle interaction based on face, body, and hand gestures, and offer ...

Shanghai Orient-chip Technology (OCS) is a deep tech company that focuses on integrated IC and optoelectronics product. Headquarters of the company are in Shanghai, China and its R&D centers locate in Shanghai, Taipei and Hsinchu. OCS’s IC and optoelectronics R&D teams focus on TX total solution for Time of Flight (TOF) since 2015. They developed a series VCSEL package for TOF that integrates metal holder and brings two advantage. First, heat dissipation on metal holder product is better then plastic holder product. Second, metal holde...

In this press release, TrendForce provides predictions of the information and communication technology industry for 2020, focusing on 10 key themes. Demand from AI, 5G, and automotive will push back against headwinds in the global semiconductor market The global semiconductor market has been in a slump this year on account of the fallout from the US-China trade dispute. Although the demand outlook remains uncertain for 2020, TrendForce expects the market to make a gradual recovery on the back of the demand related to 5G, AI, and automotive applications. The strategies...

German semiconductor maker Infineon announced that it has teamed up with LG Electronics to introduce Time-of-Flight (ToF) technology adopted front-facing camera on the latest smartphone of LG which will be revealed at Mobile World Congress 2019 in Barcelona. Infineon has provided its REAL3™ image sensor chip to LG’s upcoming G8 ThinQ. With Infineon’s pmdtechnologies in algorithms for processed 3D point clouds (a set of data points in space produced by 3D scanning), the innovative sensor will deliver a new level of front camera capability in a...

ams announced the launch of MERANO-Photodiode (PD), an in-frared (IR) laser flood illuminator module which provides the uniform light output needed in mobile 3D sensing applications such as user face recognition. By introducing a VCSEL-based flood illuminator in a slim package, ams aims to ehance the adoption of 3D sensing applications in mainstream mobile phones. Its 2W Merano-PD is suitable for use in the latest technologies for 3D sensing, including ToF and structured light methods. Applications such as face recognition, augmented reality, 3D object scannin...

In order to improve the performance of mobile phone camera, Germany-based semiconductor solution provider Infineon announced that it has enhanced its REAL3™ image sensor based on Time-of-Flight (ToF). Infineon is presenting the product at Mobile World Congress 2019 which is taking place in Barcelona from February 25 to 28. The 3D ToF single chip is designed to meet the requirements of the mobile consumer device market and demand for higher resolutions with small lenses. The chip can be applied in user authentication like face or hand recognition. In addition, ...

According to the latest “LEDinside 2019 Infrared Sensing Application Market Report- Mobile Sensing, LiDAR and Optical Sensing” various IR products have kept developing, which have brought about unlimited business opportunities. LEDinside focuses on the applications as follows, including security surveillance, biometric recognition on mobile device (iris, 2D facial, under display fingerprint recognition- optical and ultrasonic, 3D facial recognition- structured light, ToF, stereo vision), digital medical care (pulse, oximetry, glucose sensing), spectral sensing, automotive sensing (facial and gesture) and automotive LiDAR, drone, AGV, proximity sensor, optical communication, etc. Market scale, opportunities, challenges, product specification and supply chain is discussed and analyzed in this report, which helps readers to have an overall understanding to infrared application markets.