Osram revealed an intelligent emitter module for 3D sensing which allows smartphones to take high-quality images and videos with staggered depth of field. Besides optimizing image content, the module can also be used for 3D object recognition or AR applications.

The product is designed to strengthen camera function of smartphones. Innovative functionalities of mobile devices require components to fit into ever smaller spaces. A central task for manufacturers has been to find the right emitters, photodiodes and VCSEL driver chips (ICs), then calibrate them and finally install them in the end device. With the VCSEL-based module Bidos PLPVDC 940_P_L01 for Time-of-Flight-(ToF) applications, Osram now eliminates a large part of these tasks for manufacturers.

(Image: Osram)

The module features a 3-Watt infrared VCSEL with a wavelength of 940 nm, a matching optical system, an integrated intelligent microcontroller for driving the VCSEL and a photodiode. Together, the individual components have a footprint of 3.6 mm x 5.46 mm. The high optical power enables the acquisition of depth information by ToF technology at a distance of up to seven meters. In addition to optimizing image content, customers can also use the depth information for other functions in the smartphone, including 3D object recognition and AR applications like games and interior design.

In addition, Osram included safety mechanisms in the module for eye safety. If the photodiode registers a change in the incidence of light – for example, if the optics are damaged after a fall – the current supply to the VCSEL is interrupted.