2023-01-05

Kulicke & Soffa Joins Hi-CHIP - Heterogeneous Integration and Chiplet System Package Alliance

Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S" or the "Company") today announced the Company has joined the Heterogeneous Integration and Chiplet System Package Alliance (Hi-CHIP), an initiative led by the Taiwan-based Industrial Technology Research Institute (ITRI), in collaboration with other major industry players.         The Hi-CHIP alliance leverages Kulicke & Soffa's Advanced Packaging competencies and its LITEQ 500 lithography p...
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Violumas, provider of high-power UV LED solutions and inventor of 3-PAD LED technology, is proud to launch the release of new 275nm and 265nm LEDs in mid-power, high-power, and high-density packages. The radiant flux of the new 275nm and 265nm... READ MORE

DURHAM, NC – November 12, 2024 –– Cree LED, a Penguin Solutions brand (Nasdaq: PENG), today announced the launch of its new CV28D LEDs with FusionBeam™ Technology, a groundbreaking advancement for the LED signage market... READ MORE