As glass substrates gain traction as a key material for next-generation AI semiconductor packaging, related technologies are drawing increasing industry attention. According to ETNews, Chonnam National University said a research team led by Professor Han Seung-hoe from the Department of Mechanical Engineering has developed an “ultrashort-pulse laser-induced chemical vapor deposition (ULCVD)” technology. The report indicates that the method uses an ultrafast femtosecond laser to directly inscribe conductive carbon circuits on both sides of transparent subs...