TrendForce's latest research on the optical communications industry reveals that NVIDIA has begun shipping its next-generation Spectrum-X CPO switch to select partners. Meanwhile, Broadcom is continuing limited shipments of its 51.2T Bailly CPO switch, marking the official transition of co-packaged optics (CPO) into the mass production phase. The supply capacity of key components, including optical engines, silicon photonics chips, and advanced packaging, is expected to become the primary factor determining the pace of future production expansion. TrendFor...

A high-end compound semiconductor substrate project with a total investment of RMB 2 billion (approximately USD 280 million) has been officially approved and will be established in Quzhou, Zhejiang Province, according to the Zhejiang Provincial Online Investment Project Approval and Supervision Platform. The project will be developed by Vital Micro-Electronics Technology (Zhejiang) Co., Ltd. and is designed to deliver an annual production capacity of 3 million gallium arsenide (GaAs) substrates and 3 million indium phosphide (InP) substrates, for a combine...

SILITH Technology, a silicon photonics fabless company, and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced the first mass-production wafer delivery of photonic ICs from UMC’s Singapore fab, advancing the partnership between the two companies to scale next-generation silicon photonics manufacturing. The collaboration combines SILITH’s photonics design expertise with UMC’s 12-inch wafer manufacturing capacity and process capabilities to support hig...

Huawei, Baidu and other industry partners have launched China’s first multi-source agreement (MSA) for near-packaged optics (NPO), aiming to establish an open and unified technical standard framework for next-generation high-speed optical interconnects and accelerate ecosystem collaboration. According to Huawei Computing’s official WeChat account, the Supernode and GW-level AIDC Technology Forum, along with the Open AI Infra Community’s semiannual meeting, was held in Beijing on July 9 under the guidance of the Global Computing Consort...

GlassBridge™ is a wafer‑based fiber‑to‑PIC technology platform designed to support scalable manufacturing, robust TMT‑compatible interfaces, and detachable high‑channel‑count connectivity. Built on Corning’s expertise in glass science and precision manufacturing, GlassBridge enables flexibility and density without compromising reliability. As part of a broader connector system architecture, GlassBridge functions both as a precise glass component and as a complete connector assembly, providing system designers with a practical, manufacturable path to next‑...

On May 26, SmartSens Technology and UNISOC announced a strategic partnership to jointly advance high-speed Micro LED optical interconnect technology. The collaboration will focus on optical interconnect chip design and system-level solutions, targeting short-reach, high-speed connectivity for AI computing clusters with domestically developed solutions featuring high bandwidth, low power consumption, and high integration. Under the partnership, both sides will develop a next-generation Micro LED CPO optical interconnect solution. Built on SmartSens’ op...

U.S.-based AI infrastructure company Fabric. AI recently announced plans to demonstrate its flagship Micro LED optical interconnect platform by the end of 2026. Fabric.AI is developing a fabless semiconductor technology stack aimed at next-generation AI data centers. Its core product, Neural I/o™, is a Micro LED-based optical interconnect platform jointly developed with microdisplay company Kopin. The platform is designed to address growing bottlenecks in AI infrastructure, particularly data transfer efficiency among GPUs, accelerators, memory system...

Google’s next-generation TPU, Ironwood, integrates a 3D Torus network topology with the Apollo optical circuit switch (OCS) all-optical network, marking a major step forward in AI data-center interconnect design. TrendForce’s latest research on the high-speed interconnect market indicates that this architecture will directly address the surging compute and bandwidth demands driven by large-scale AI workloads. TrendForce estimates that the global shipment share of 800G and above optical transceiver modules will climb from 19.5% in 2024 to over 60% by 2026, p...