U.S.-based AI infrastructure company Fabric. AI recently announced plans to demonstrate its flagship Micro LED optical interconnect platform by the end of 2026. Fabric.AI is developing a fabless semiconductor technology stack aimed at next-generation AI data centers. Its core product, Neural I/o™, is a Micro LED-based optical interconnect platform jointly developed with microdisplay company Kopin. The platform is designed to address growing bottlenecks in AI infrastructure, particularly data transfer efficiency among GPUs, accelerators, memory system...

Google’s next-generation TPU, Ironwood, integrates a 3D Torus network topology with the Apollo optical circuit switch (OCS) all-optical network, marking a major step forward in AI data-center interconnect design. TrendForce’s latest research on the high-speed interconnect market indicates that this architecture will directly address the surging compute and bandwidth demands driven by large-scale AI workloads. TrendForce estimates that the global shipment share of 800G and above optical transceiver modules will climb from 19.5% in 2024 to over 60% by 2026, p...