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2009-07-09

Dow Corning Electronics Announces New Silicone Encapsulant for Overmolding Process

Today Dow Corning Corporation’s Electronics group introduced its newest silicone encapsulant, Dow Corning ®OE-6636, designed for overmolding (compression molding) and dispensing processes. The product provides for a high refractive index (RI) of 1.54 which enables better light output (see Appendix 1, below), has a low moisture uptake, improves thermal aging  and light resistance, and possesses better adhesion to typical substrate for LED packages such as Poly Phthal Amid.
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[News] Samsung Enhances the Walmart AMP Live Event Experience with New Outdoor LED Displays

Samsung Electronics America is enhancing the fan experience at the Walmart Arkansas Music Pavilion (AMP) with an ecosystem of Outdoor LED video walls, TVs and Galaxy tablets. From the front row to the farthest corners of the outdoor venue, Sam... READ MORE

[News] Samsung Reportedly Set to Unveil 115-Inch RGB Micro LED TV in June

According to The Elec, Samsung has announced plans to launch a 115-inch RGB Micro LED TV later this year. The new model will be part of the company’s Neo QLED TV lineup but positioned as an ultra-high-end version. In contrast, current Ne... READ MORE

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