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2009-07-09

Dow Corning Electronics Announces New Silicone Encapsulant for Overmolding Process

Today Dow Corning Corporation’s Electronics group introduced its newest silicone encapsulant, Dow Corning ®OE-6636, designed for overmolding (compression molding) and dispensing processes. The product provides for a high refractive index (RI) of 1.54 which enables better light output (see Appendix 1, below), has a low moisture uptake, improves thermal aging  and light resistance, and possesses better adhesion to typical substrate for LED packages such as Poly Phthal Amid.
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[News] Violumas Offers More UVC Intensity in Next Gen UV LEDs

Violumas, provider of high-power UV LED solutions and inventor of 3-PAD LED technology, has released its next-generation 255nm, 265nm, and 275nm LEDs in both SMD and COB configurations. The radiant flux of the new 275nm and 265nm LEDs has incr... READ MORE

[News] Absen Celebrates 25th Anniversary with Award Successes and Product Launches at ISE 2026

Absen, a global leader in LED display technology, has concluded a hugely successful week at Integrated Systems Europe (ISE) 2026, securing a series of prestigious accolades that highlight the company’s long history of innovation. The eve... READ MORE

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