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2009-07-09

Dow Corning Electronics Announces New Silicone Encapsulant for Overmolding Process

Today Dow Corning Corporation’s Electronics group introduced its newest silicone encapsulant, Dow Corning ®OE-6636, designed for overmolding (compression molding) and dispensing processes. The product provides for a high refractive index (RI) of 1.54 which enables better light output (see Appendix 1, below), has a low moisture uptake, improves thermal aging  and light resistance, and possesses better adhesion to typical substrate for LED packages such as Poly Phthal Amid.
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[News] Bowling Green State University Set to Unveil New Daktronics Display at Doyt Perry Stadium

Daktronics of Brookings, South Dakota, was selected by Bowling Green State University (BGSU) to manufacture and install a new LED video display at Doyt Perry Stadium in Bowling Green, Ohio. The installation will be completed ahead of the fall ... READ MORE

[News] Field of Dreams Ballpark Gets Digital Feature with Daktronics LED Display

Daktronics of Brookings, South Dakota, has manufactured and installed an LED video board in the outfield of Field of Dreams Ballpark in Dyersville, Iowa. The new facility is adjacent to the famed corn field-framed ballpark from the iconic 1989... READ MORE

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