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2009-07-09

Dow Corning Electronics Announces New Silicone Encapsulant for Overmolding Process

Today Dow Corning Corporation’s Electronics group introduced its newest silicone encapsulant, Dow Corning ®OE-6636, designed for overmolding (compression molding) and dispensing processes. The product provides for a high refractive index (RI) of 1.54 which enables better light output (see Appendix 1, below), has a low moisture uptake, improves thermal aging  and light resistance, and possesses better adhesion to typical substrate for LED packages such as Poly Phthal Amid.
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[Product News] Macroblock to Drive Advances: Captivate ISE 2025 with Groundbreaking Flagship DaVinci Series LED Driver ICs

ISE 2025, the largest European system integration trade show, marks a significant highlight for the LED display industry at the start of the year. Macroblock is excited to debut a new series of products and collaborate with industry leaders su... READ MORE

[News] ViewSonic Unveils Pioneering Control Box Designs for Seamless Large Display Adoption at ISE 2025

ViewSonic Corp., a leading global provider of visual solutions, is unveiling the world's first rack-mount All-in-One control box (LD-SCB-023) at Integrated Systems Europe (ISE) 2025. Seamlessly integrating power and control systems, the LD... READ MORE

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