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2009-07-09

Dow Corning Electronics Announces New Silicone Encapsulant for Overmolding Process

Today Dow Corning Corporation’s Electronics group introduced its newest silicone encapsulant, Dow Corning ®OE-6636, designed for overmolding (compression molding) and dispensing processes. The product provides for a high refractive index (RI) of 1.54 which enables better light output (see Appendix 1, below), has a low moisture uptake, improves thermal aging  and light resistance, and possesses better adhesion to typical substrate for LED packages such as Poly Phthal Amid.
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[News] Al Arabia Out Of Home Brings Advertising Alive on Skybridges with Daktronics LED Displays

To bring advertising to life along major roadways in Dubai, United Arab Emirates, Daktronics has partnered with Al Arabia Out Of Home, LLC, to manufacture and deliver 10 LED displays on skybridges above roadways. The project was completed late... READ MORE

[News] Compact RGGB LED Optimized for Smart Glasses

The future is right in front of our eyes: lighter, sleeker, and smarter than ever before. Smart glasses is no longer a distant vision; it is on the verge of becoming as natural to us as the smartphone is today. But turning this vision into rea... READ MORE

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