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2009-07-09

Dow Corning Electronics Announces New Silicone Encapsulant for Overmolding Process

Today Dow Corning Corporation’s Electronics group introduced its newest silicone encapsulant, Dow Corning ®OE-6636, designed for overmolding (compression molding) and dispensing processes. The product provides for a high refractive index (RI) of 1.54 which enables better light output (see Appendix 1, below), has a low moisture uptake, improves thermal aging  and light resistance, and possesses better adhesion to typical substrate for LED packages such as Poly Phthal Amid.
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[News] ams OSRAM Files Patent Infringement Complaint Against Spider Farmer – Focus on Protecting Horticulture LED Innovations

ams OSRAM, a global leader in intelligent sensor and emitter technologies, has filed a patent infringement complaint in the United States against Spider Farmer, a manufacturer of indoor farming luminaires, and has also taken further action bas... READ MORE

[News] Accelerating the Industrialization of Film Production: Unveil the Technical Achievements Behind the World’s Largest LED Virtual Production Volume

Recently, the world’s largest monolithic LED virtual production volume—jointly developed by Absen and Versatile Media—made a high-profile debut, drawing widespread attention across the industry and beyond. As a global leader ... READ MORE

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