Today Dow Corning Corporation’s Electronics group introduced its newest silicone encapsulant, Dow Corning ®OE-6636, designed for overmolding (compression molding) and dispensing processes. The product provides for a high refractive index (RI) of 1.54 which enables better light output (see Appendix 1, below), has a low moisture uptake, improves thermal aging  and light resistance, and possesses better adhesion to typical substrate for LED packages such as Poly Phthal Amid.