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2009-07-09

Dow Corning Electronics Announces New Silicone Encapsulant for Overmolding Process

Today Dow Corning Corporation’s Electronics group introduced its newest silicone encapsulant, Dow Corning ®OE-6636, designed for overmolding (compression molding) and dispensing processes. The product provides for a high refractive index (RI) of 1.54 which enables better light output (see Appendix 1, below), has a low moisture uptake, improves thermal aging  and light resistance, and possesses better adhesion to typical substrate for LED packages such as Poly Phthal Amid.
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[News] Daktronics Expands On-Premise Digital Signage with See-Through LED Window Display

Daktronics of Brookings, South Dakota, announced the availability of see‑through LED window displays for retail stores, convenience stores, gas stations, quick‑serve restaurants and shopping center environments, expanding the company’s o... READ MORE

[News] Bowling Green State University Set to Unveil New Daktronics Display at Doyt Perry Stadium

Daktronics of Brookings, South Dakota, was selected by Bowling Green State University (BGSU) to manufacture and install a new LED video display at Doyt Perry Stadium in Bowling Green, Ohio. The installation will be completed ahead of the fall ... READ MORE

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