2009-10-26

Ultra-Low Silicone Thermal Gap Filler Provides High Thermal Conductivity and Conformability

MH&W International has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0 W/mK of themal conductivity between hot components and their heat sinks.
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Ennostar today announced a breakthrough in Micro LED optical communications. The company’s R&D team has increased the single-channel -3 dB modulation bandwidth of its blue Micro LED to 2.1 GHz at a current density of 2 kA/cm². The ... READ MORE

Daktronics of Brookings, South Dakota, was asked to refresh the video display and control system at the University of Texas, El Paso’s (UTEP) Sun Bowl Stadium. The display improved resolution 4.5 times the previous screen using the Daktr... READ MORE