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Home > MH&W International
2009-10-26

Ultra-Low Silicone Thermal Gap Filler Provides High Thermal Conductivity and Conformability

MH&W International has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0 W/mK of themal conductivity between hot components and their heat sinks.
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[News] Samsung Enhances LED Display Lineup with The Wall MPF Series
Samsung today announced a new edition of its large-format LED display, The Wall, marking a pivotal expansion to its Chip on Board (CoB) lineup. Like earlier models of The Wall, the MPF series optimizes viewing experiences across an array of en... READ MORE
[News] CreeLED Inc. Files Patent Infringement Lawsuit Against Promier Products, Inc. (d/b/a LitezAll) and Tractor Supply Co.

Cree LED, a Penguin Solutions brand (Nasdaq: PENG), today announced that it has filed a patent infringement lawsuit in the United States District Court for the Northern District of Illinois against Promier Products and Tractor Supply. The laws... READ MORE

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