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2009-10-26

Ultra-Low Silicone Thermal Gap Filler Provides High Thermal Conductivity and Conformability

MH&W International has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0 W/mK of themal conductivity between hot components and their heat sinks.

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[Product News] Macroblock to Drive Advances: Captivate ISE 2025 with Groundbreaking Flagship DaVinci Series LED Driver ICs

ISE 2025, the largest European system integration trade show, marks a significant highlight for the LED display industry at the start of the year. Macroblock is excited to debut a new series of products and collaborate with industry leaders su... READ MORE

[News] ViewSonic Unveils Pioneering Control Box Designs for Seamless Large Display Adoption at ISE 2025

ViewSonic Corp., a leading global provider of visual solutions, is unveiling the world's first rack-mount All-in-One control box (LD-SCB-023) at Integrated Systems Europe (ISE) 2025. Seamlessly integrating power and control systems, the LD... READ MORE

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