2009-10-26

Ultra-Low Silicone Thermal Gap Filler Provides High Thermal Conductivity and Conformability

MH&W International has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0 W/mK of themal conductivity between hot components and their heat sinks.
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France-based car maker Peugeot unveiled a new concept car, the Peugeot RCZ Vision, building on the company's 2009-2015 RCZ coupe - with a host of new technologies. The RCZ Vision, build on Stellantis' STLA One architecture, is an ele... READ MORE