2009-10-26

Ultra-Low Silicone Thermal Gap Filler Provides High Thermal Conductivity and Conformability

MH&W International has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0 W/mK of themal conductivity between hot components and their heat sinks.
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ams OSRAM’s OSIRE® E3731i and Stand-Alone Intelligent Driver (SAID) use OSP license-free protocol to connect color LEDs, sensors and microcontrollers. ams OSRAM, a global leader in intelligent emitting and sensing technologies, will... READ MORE

JBD, a pioneering MicroLED display manufacturer, has set a new standard with its Phoenix series microdisplay, achieving an industry-record white-balanced brightness of 2 million nits. JBD’s Phoenix - Native Monolithic RGB Panel Leveragin... READ MORE