2009-10-26

Ultra-Low Silicone Thermal Gap Filler Provides High Thermal Conductivity and Conformability

MH&W International has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0 W/mK of themal conductivity between hot components and their heat sinks.
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Macroblock and Juxin Optoelectronics successfully held 2026 LED Display Symposium at the Shenzhen Marriott Hotel. In addition to the main-stage sessions, which focused on display industry trends and technology sharing, the exhibition area feature... READ MORE

Signify, the world leader in lighting, announces that Kwekerij Bolleboom in Bleiswijk and Kwekerij Bazuin in Pijnacker in the Netherlands are investing in Philips GreenPower LED toplighting force elite and Philips GrowWise control for their cu... READ MORE