2011-06-13

Lextar to Make A Debut of its Chip Array COB and 150 lm/W LED Packaging Products at the Guangzhou International Lighting Exhibition

Lextar debuts its new Chip Array COB technology and high efficiency (up to 150 lm/W) LED packaging products. Both was presented in the 2011 Guangzhou International Lighting Exhibition held from the ninth to twelfth of this month.   COB (Chip on Board): Lextar exhibits a series of LED components including COB and LED package. In terms of COB, the newly developed Chip Array COB technology employs exclusive mechanical design and unique material for improved cost.    With a 15-20% more efficient COB the Chip Array COB feature...
Continue reading
From June 10 to 12 in Amsterdam, GreenTech visitors can explore how the latest-generation LED and sensor solutions from ams OSRAM enhance plant growth, save energy, and promote sustainable farming. At Hall 05, Booth 05.357, attendees will expe... READ MORE

The number of modern applications using 3D sensor technologies is steadily increasing, including ambient sensing for industrial robots, various face recognition applications, object detection, and machine vision. Vertical Cavity Surface Emitti... READ MORE