2011-12-01

SIPLACE Press Conference:SIPLACE team well-positioned for the future of electronics production

Good news from the management of ASM Assembly Systems GmbH & Co. KG (formerly Siemens Electronics Assembly Systems) at the SIPLACE press conference in Shenzhen. SIPLACE COO in China, Herbert Hofmann, presented a whole series off innovative SIPLACE solutions for the following process steps: new product introduction (NPI), setup changeover and production run. Based on the globally leading SIPLACE placement platform, integrated hardware, software and service innovation will help especially electronics manufacturers in China and Asia to...
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Aledia, the leader in nanowire and 3D silicon-based microLED display technology, is proud to announce it is a winner in the Computing, Chips, and Foundational Technology category in Fast Company’s Next Big Things in Tech list. This prest... READ MORE

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