2011-12-01

SIPLACE Press Conference:SIPLACE team well-positioned for the future of electronics production

Good news from the management of ASM Assembly Systems GmbH & Co. KG (formerly Siemens Electronics Assembly Systems) at the SIPLACE press conference in Shenzhen. SIPLACE COO in China, Herbert Hofmann, presented a whole series off innovative SIPLACE solutions for the following process steps: new product introduction (NPI), setup changeover and production run. Based on the globally leading SIPLACE placement platform, integrated hardware, software and service innovation will help especially electronics manufacturers in China and Asia to...
Continue reading

The number of modern applications using 3D sensor technologies is steadily increasing, including ambient sensing for industrial robots, various face recognition applications, object detection, and machine vision. Vertical Cavity Surface Emitti... READ MORE

Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LED, is pleased to announce that a UV-C LED disinfection device manufactured by Mutoh Industries Ltd., equipped with Nichia's high-power 28... READ MORE