2012-03-07

Mo-Cu Wafer Substrate for LED Chips

Newly, Plansee High Performance Materials has utilized Mo-Cu R670 to develop a new molybdenum-copper composite material for semiconductor wafer substrates. With Mo-Cu R670, the new material has optimised heat dissipation in LED chips, as well as the same coefficient of thermal expansion as sapphire, and therefore reduces defects in the semiconductor structure which can occur during the hot bonding process. Commonly, the production of blue spectrum chips- including white LEDs - GaN-based semiconductor layers are grown on sapphire substrate (Al2O3) using epitaxial ...
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This year's report plays a key role in aligning with the upcoming standards of the European Union and is built on a significantly broader data foundation than in previous years. For the first time, the report includes all LEDVANCE entities... READ MORE

Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LEDs, is pleased to announce that Cube Direct Mountable Chip received the LightFair Innovation Awards in the LED Chips & Modules category. ... READ MORE