Newly, Plansee High Performance Materials has utilized Mo-Cu R670 to develop a new molybdenum-copper composite material for semiconductor wafer substrates. With Mo-Cu R670, the new material has optimised heat dissipation in LED chips, as well as the same coefficient of thermal expansion as sapphire, and therefore reduces defects in the semiconductor structure which can occur during the hot bonding process. Commonly, the production of blue spectrum chips- including white LEDs - GaN-based semiconductor layers are grown on sapphire substrate (Al2O3) using epitaxial ...