2012-03-07

Mo-Cu Wafer Substrate for LED Chips

Newly, Plansee High Performance Materials has utilized Mo-Cu R670 to develop a new molybdenum-copper composite material for semiconductor wafer substrates. With Mo-Cu R670, the new material has optimised heat dissipation in LED chips, as well as the same coefficient of thermal expansion as sapphire, and therefore reduces defects in the semiconductor structure which can occur during the hot bonding process. Commonly, the production of blue spectrum chips- including white LEDs - GaN-based semiconductor layers are grown on sapphire substrate (Al2O3) using epitaxial ...
Continue reading
Recently, OMINSU Vietnam signed a strategic agreement with Seoul Semiconductor, marking a pivotal turning point in elevating the “Made in Vietnam” LED lighting brand. At the signing ceremony, Vietnam’s OMINSU and Seoul Semicond... READ MORE
From June 19 to 22, 2025, Samsung Electronics will collaborate with globally renowned artists to celebrate global diversity, artistic innovation and the power of display technology at Art Basel in Basel 2025, the world’s largest art fair he... READ MORE