Daewon Innost has made a breakthrough on its Glaxum LED Array family of chip on board (COB) modules, which it claims to achieve the LED industry’s best thermal dissipation performance. The proprietary Nano-Pore Silicon Substrate (NPSS) technology developed by Daewon Innost led to thermal impedance of 0.41°C/W. Daewon Innost’s NPSS is created by applying semiconductor lithography to silicon wafers, allowing for 50µm-pitch interconnection between gallium nitride (GaN) LED chips; conventional metal-core printed circuit boards (MC...