Tong Hsin Electronics Industry’s (THEI) will be raising the bar for competitors by increasing ceramic substrate laser drilling speed and adding packaging services as LED chip piece volumes used on substrates grow exponentially, said the company President Heinz Ru during a recent investor conference. The changes occurred in response to strong demands for LED ceramic substrates in the lighting market despite of impacts from Cree’s low-priced LED bulbs during the first half of 2013. Ru forecasted shipments for ceramic substrates applied in high-powered LEDs will continue to grow in 3Q13.