Many SiC-based substrate manufacturers exhibited 6-inch (150mm)-diameter wafers at ICSCRM 2013, an international conference on SiC-based power semiconductors, which took place from Sept 29 to Oct 4, 2013, in Miyazaki, Japan. Six-inch wafers are the successors to the current 3-4-inch (75-100mm) wafers. Thus far, Cree Inc. has been leading the supply of 6-inch wafers. But companies that are trying to catch up with Cree are expected to launch their 6-inch wafers one after the other from the second half of 2013 to 2014. Nippon Steel & Sumitomo Metal Corp (N...