2013-10-31

Price Pressure Pushes LED Package Manufacturers Move Towards EMCs

The trend in lowered prices in the LED market has not changed. With LED chip prices expected to drop substantially in the next few years, packaging is also facing pressure to lower costs. According to current LED component costs, package costs make up 60 percent of the overall cost. U.S. DOE estimates that LED package costs will drop 50 percent by 2016. Advantages in Epoxy Molding Compound (EMC) lead frames in galvanizing high electrical currents, having UV resistance, and ability to withstand high temperatures has draw the attention of package manufacturers. Philips Lumileds plans to introduce high volume EMC lead frame LED package components in 2014. 
Continue reading

The TMF8829 direct Time-of-Flight (dToF) sensor significantly increases resolution — from the previously common 8×8 zones to 48×32 — and it is designed to detect subtle spatial differences and distinguish closely spaced... READ MORE

Introducing the New J Series® 3030S 3V & 6V LEDs Cree LED is expanding the proven J Series 3030 portfolio with four new high-performance LEDs that combine a 757-footprint with outstanding efficacy and drop-in compatibility with popula... READ MORE