2013-12-04

Dow Corning Launches New Dispensable Thermal Pads

Dow Corning, a global leader in silicones, silicon-based technology and innovation, today introduced new Dow Corning® Dispensable Thermal Pads, an advanced new technology developed for more cost-effective thermal management of high-performance electronics targeting LED lamp and luminaires, data servers, telecommunications equipment and transportation applications. The new materials enable manufacturers to quickly and precisely print a layer of thermally conductive curable silicone compound in controllable thicknesses on complex-shaped substrates while ensuring excellent thermal management properties and reduced manufacturing cost.
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