2013-12-04

Dow Corning Launches New Dispensable Thermal Pads

Dow Corning, a global leader in silicones, silicon-based technology and innovation, today introduced new Dow Corning® Dispensable Thermal Pads, an advanced new technology developed for more cost-effective thermal management of high-performance electronics targeting LED lamp and luminaires, data servers, telecommunications equipment and transportation applications. The new materials enable manufacturers to quickly and precisely print a layer of thermally conductive curable silicone compound in controllable thicknesses on complex-shaped substrates while ensuring excellent thermal management properties and reduced manufacturing cost.
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SEOUL, South Korea--Seoul Semiconductor (KOSDAQ: 046890), a global leader in optical semiconductors, introduces natural light technology (sunlight) and displays as the new paradigm in lighting. The company announced on the 27th that it will pa... READ MORE

ams OSRAM (SIX: AMS) has reached another important milestone in automotive lighting now that the new OSRAM XLS LR6 LED is ready for series production. This innovative solution enables car manufacturers to create impressive lighting designs wit... READ MORE