PhD. Bhardwaj Jyoti, Senior Vice President, R&D, Philips Lumileds gives detailed information about the development of chip scale package technology in this article. Chip scale packages are novel to the LED industry but they are the mainstay of the semiconductor industry. Development of CSP in the Si ICs was driven by miniaturization, improved thermals, higher reliability, and simply the need to connect to an ever increasing pin-count on an ever shrinking die. Chip Scale packages also enabled a reduction in device parasitic and allowed for ease of integration into Level 2 packaging. It is therefore a natural evolution for such packaging innovation to proliferate into other industries including the LED product space and therefore not surprising that Chip-scale packaging has made inroads into the LED industry as recently released by Philips Lumileds.