The maturation of LED technology and lighting applications have allowed flip-chips to become the star of 2013. Genesis Photonics Inc. (GPI) has been producing flip chip products for over three years. In 2013, the company expanded into the new field of flip chip packaging and its development direction has been technological vertical integration. Elimination of wire bonding during the manufacturing process can effectively reduce LEDs damage risks. GPI plans to continue introducing flip chips into special application markets for street lights, tunnel lighting, and factory lighting, which require products with high reliability.