Grenoble, the center of one of Europe’s key microelectronics ecosystems, is hosting SEMICON Europa 2014 Oct. 7-9.

This is the first time France has hosted the premier annual event for the European chip industry, which achieved a 7.9 percent market growth during the first semester of 2014, according to WSTS association. SEMI, the global trade organization that organizes the SEMICON gatherings, will alternate SEMICON Europa every other year between Dresden and Grenoble beginning this year.

The event in the ALPEXPO Congress Center is expected to draw more than 6,000 visitors and 400 companies, and will help showcase the Grenoble-Isère region’s strong microelectronics ecosystem, including worldwide microelectronics suppliers, leading R&D institutes, world-class universities and critical mass of tech companies.

As one of the event’s supporters, Leti is staging a 90-square-meter booth (number 1360 in the Science Park) to highlight its R&D themes of silicon technology, imaging/photonics/display, embedded systems, design, health and security. The booth with feature Leti’s mobile showroom, which demonstrates some of the exhibits on display in Leti’s permanent showroom on the MINATEC Campus.

Representatives from IRT Nanoelec, which includes 18 public- and private-sector research partners, will also be at the booth to present how industrials from all sectors can benefit from the rich technological offering of the Grenoble ecosystem.

In addition, Leti experts in fields ranging from low-power multiprocessing to future lithography options will present their insights and outlook in 10 sessions. Four sessions will be chaired by Leti.

Times and places/Leti speakers

Tuesday, Oct. 7

• Nanoelectronics for Healthcare Session, TechARENA 1, ALPEXPO
• 10:15 a.m. Introduduction - Didier Louis, session chair and Leti international communication manager            
• 11:40 a.m. Microsensors for Health Applications, Eric Gouze, Leti business development manager
• Low Power Conference: Highly Energy Efficient Nanotechnologies and Applications, Room Meije 2+3, ALPEXPO
• Session 3, Processors
• 4:20 p.m. Low-power Multiprocessing - Fabien Clermidy, senior expert, CEA-LETI
• Session 4, Energy-efficient Design Techniques 5:10 p.m., Fabien Clermidy, chair

Wednesday, Oct. 8

• Imaging Conference, Room Sept Laux 4+5, ALPEXPO>
• Session 3, Consumer
• 10:25 a.m. Spectral Filtering on CMOS Image Sensors with Metal Dielectric Multilayers, Laurent Frey, Leti senior research scientist
• Session 5, Industrial and Professional
• 2 p.m. Introduction, Bruno Mouray, session chair and vice president of Leti’s Optic and Photonics Division
• 3D-Integration Session, TechARENA 1, ALPEXPO
• 3:20 p.m. Technological Challenges and Applications of 3D Sequential Integration, Claire Fenouillet-Béranger, Leti senior scientist
• Power Electronics Conference: the Ultimate Path to CO2 Reduction, Room Meije 2+3, ALPEXPO
• Session 1, Applications
• 3:05 p.m. GaN on Silicon: A Way to Low-cost Power Devices,   Jean-Jacques Aubert, Leti program manager for power electronics
• 16^th European Manufacturing Test Conference, TechARENA 2, ALPEXPO, 4 p.m.
• Panel Discussion: Gaining a European Competitive Edge through Test InnovationAlain Toffoli, Leti electrical characterization research engineer

Thursday, Oct. 9

• Lithography Session: What Are the Lithography Options for Tomorrow?, TechARENA 1, ALPEXPO
• 12 p.m. Introduction, Serge Tedesco, session chair and Leti lithography program manager
• 12:30 p.m. Maskless Lithography for Volume Manufacturing, Ludovic Lattard, Leti laboratory deputy manager