Samsung Electronics, a world leader in advanced components, today introduced the LM301A, a flip-chip-based mid-power LED package that can operate at anywhere from 0.2 watts to 1 watt — providing a wide range of current options, resulting in much improved light efficacy. The package was announced at a press conference, in conjunction with LIGHTFAIR International 2015, being held in New York, May 5-7.

Coming in a 3.0mm by 3.0mm form factor that is increasingly popular in LED lighting applications today, the new LM301A’s lower and wider current alternatives are a result of Samsung flip chip technology, which allows the LED chip to have the shortest distance from the junction to the base of a package, and eliminates the need for metal wire bonding in the packaging process. These changes enable much lower heat resistance compared to conventional epi-up chip technology – an approximate five percent temperature drop per watt within a more desirable 25°C to 85°C temperature range.

Samsung’s new LM301A LED package offers the following light efficacy alternatives:"Designed with advanced flip chip technology, the new LM301A overcomes what had been significant performance and power limitations of conventional mid-power lighting LED packages,” said Dr. Jacob Tarn, Executive Vice President, LED Lighting Business Team, Samsung Electronics. “We will continue to strengthen our technology leadership in the market by launching highly competitive, next generation LED products based on Samsung’s most innovative, market-proven LED technologies.”

• 170lm/W efficacy in cool white (5000K CCT, CRI80+, 85°C and 65mA)
• 160lm/W efficacy in warm white (3000K CCT, CRI80+, 85°C and 65mA)
• 155lm/W efficacy in cool white (5000K CCT, CRI80+, 85°C, and 150mA)
• 145lm/W efficacy in warm white (3000K CCT, CRI80+, 85°C and 150mA)
• 130lm/W efficacy in cool white (5000K CCT, CRI80+, 85°C, and 350mA)
• 120lm/W efficacy in warm white (3000K CCT, CRI80+, 85°C and 350mA)

The light efficacy levels make the LM301A package well suited for diverse lighting applications ranging from ambient to high intensity lighting, such as high bays and outdoor lighting. In addition, the performance and cost-competitiveness of the new mid-power package should also be well regarded by lighting fixture manufacturers.

The LM301A features Epoxy Mold Compound (EMC) packaging, which makes it more reliable and extends its lifespan. Compared to existing Polyphthalamide (PPA) and PCT materials now extensively used in LED packaging, Samsung’s EMC packaging offers more protection against heat and UV rays, making it suitable for high-luminance LED applications requiring higher wattage.

The new package also will support CCT (Correlated Color Temperature) specifications ranging from 2700K to 6500K.

The LM301A will be available beginning in July.