OpenLight, a leader in heterogeneous III V silicon photonic integration and custom Photonic Application Specific Integrated Circuits (PASICs), will showcase multiple technology breakthroughs at the Optical Fiber Communication Conference and Exhibition (OFC) 2026, taking place March 15–19 at the Los Angeles Convention Center. At booth #2449, OpenLight will demonstrate its latest advances in high speed photonic integrated circuits (PICs) with integrated lasers, electro absorption (EA) modulators, and amplifiers. These demonstrations show next generation optical architectures designed to meet the performance, efficiency, and scalability demands of AI, cloud, and hyperscale data center networks.

OpenLight’s OFC 2026 presence will highlight industry demonstrations, new product collaborations, and thought leadership sessions featuring the company’s engineering and executive teams, demonstrating that its technology is ready for production scaling.

Live Demonstrations: Advancing AI Scale Optical Interconnects

400G Per Lane III V on Silicon EA Modulator for 3.2T and Beyond

Building on the technology first demonstrated at OFC 2025, OpenLight will showcase leading edge enhanced 400G per lane EA modulator featuring flip chip co packaging with a MACOM driver, delivering optical modulation amplitude (OMA) of 3 dBm and extinction ratio greater than 3.5 dB. This year’s demonstration highlights significant improvements in integration maturity and manufacturability, enabling differential drive and advances in bandwidth performance—made possible through OpenLight’s production ready heterogeneous III V on silicon photonics platform. These advancements further strengthen the scalability of OpenLight’s PDK devices for next-generation 3.2T and beyond high-density, low-power optical transceivers supporting AI, ML, and cloud data center deployments.

1.6T DR8 Fully Integrated Transceiver PIC and Evaluation Board 

OpenLight will also demonstrate a 1.6T DR8 evaluation board incorporating its beta 1.6T DFB-based PIC including heterogeneous integrated lasers, modulators, amplifiers and photo detectors operating with a Marvell® Ara 3 nm 1.6T digital signal processor (DSP). The PIC integrates OpenLight’s 1310 nm distributed feedback (DFB) lasers and InP based 224G electro absorption modulators (EAMs) and now delivers improved power efficiency, consuming approximately 2.0 W, down from 2.7 W reported at initial sample availability. This demonstration showcases a complete high speed optical link representative of emerging AI cluster and data center requirements, featuring full flip-chip co-packaging of the DSP, transmitter PIC, and receiver with no external laser alignment.

Additional In-booth Partner Technology Showcases

OpenLight will further highlight collaborations with technology and ecosystem partners, including:

• Oriole Networks, demonstrating a scalable, all passive backend network technology for AI workloads, built on silicon photonics nanosecond optical circuit switching, with predictable and low tail latency.
• GDS Factory, showcasing an all in one, schematic driven design solution for the OpenLight platform that combines advanced PH18DA device modeling with programmatic layout, verification, and seamless post layout simulation for confident complex circuit design.
• Spark Photonics, presenting its design and layout services using the OpenLight Process Design Kit (PDK) with the Luceda Photonics software suite.

TrendForce 2026 Infrared Sensing Application Market and Branding Strategies
Release: 01 January 2026
Format: PDF / EXCEL
Language: Traditional Chinese / English
Page: 168