Alpha to Introduce New ALPHA® LED Materials Technologies at Strategies in Light

Alpha, the world leader in the production of electronic soldering materials, will introduce its new line of ALPHA® LED compatible materials technologies at Strategies in Light Exposition & Conference, Oct. 21-23, at the M.O.C. Event Center in Munich, Germany. These product technologies provide the needed performance and value across the LED lighting system manufacturing process from: Die Attach & Package, Package on Board, Luminaire Module, Power Driver/Supply and Control Systems.

“Alpha’s strong understanding of emerging trends in LED markets and applications, and our strong focus on R&D has resulted in several innovative products for the LED market. We look forward to showcasing our leading edge LED die attach and assembly materials products for applications such as super high power LED attach, flip chip bonding, chip on board, and LED package assembly on PET flex circuits at SIL Europe”, said Ravi Bhatkal, VP of Energy Technologies at Alpha.

Alpha's Lumet P53 solder paste for LED package assembly. (Alpha/LEDinside)

In particular, Alpha will introduce Lumet™ P53 solder paste with SBX02 alloy for LED package assembly on PET flexible circuits. Enabling use of PET flexible circuits can provide significant system cost benefits compared to either FR4 rigid boards or Polyimide flexible circuits. Lumet™ P53 solder paste with SBX02 alloy provides low temperature LED package on PET reflow capability, which enables the use of PET flex substrates. Lumet™ P53 with SBX02 alloy for LED package on PET assembly also enables the use of SAC or MAXREL™ solder based die attach in package, by providing the required temperature cascade for preventing secondary reflow of the die attach layer.

Furthermore, for Level 1 LED applications, Alpha will showcase its LED die attach offerings Argomax® film and “Ultra-Fast Sintering” (UFS) technology for super high power vertical LEDs, Fortibond™ pressureless sintering Ag printable and dispensable die attach pastes with very high thermal conductivity, Atrox™ dispensable pastes for direct bonding to bare silicon and bare copper for GaN on Si applications and Lumet™ solder pastes for Chip-on-Board applications.

Alpha will also showcase Lumet™ line of solder pastes with SAC and the new MAXREL™ family alloys. These products deliver improved thermal cycling performance improved vibration resistance for LED assemblies. In addition, ALPHA® cored solder wire; Exactalloy® MAXREL™ solder performs; and SnCX Plus™ zero silver bar solder alloy.

For more information about ALPHA® LED materials technologies, go to

http://alpha.alent.com/Markets/LED.

Or, send an email to: Amit D. Patel – Energy Technologies Analyst, apatel@alent.com

alphaledtechnologies@alent.com.

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