Alpha Assembly Solutions, a major provider of electronic soldering and bonding materials, and the Lighting Enabled Systems and Applications Center (LESA), A National Science Foundation Engineering Research Center at Rensselaer Polytechnic Institute (RPI), are pleased to announce that Gyan Dutt, Technical Marketing Manager at Alpha and Dr. Robert Karlicek, Director of LESA at RPI, have co-chaired the 2017 iNEMI Solid State Illumination Industry Roadmap.
(Alpha Assembly Solutions/ LEDinside)
The iNEMI organization roadmaps the future technology requirements of the global electronics industry, identifies and prioritizes technology and infrastructure gaps, and helps eliminate those gaps through timely, high-impact deployment projects.
“The 2017 cycle Solid State Illumination road-mapping exercise was particularly challenging as well as rewarding due to rapidly growing
LED lighting adoption, growth of new exciting applications and significant efforts on integration and cost reduction (both package and system level) over the last two years,” said Gyan Dutt of Alpha Assembly Solutions.
“The chapter addresses the key trends in packaging technology like flip-chip/ CSP growth, chip-on-boad (COB) and new substrate approaches for thermal management and flexible form factors.”
In regards to emerging technologies, Dr. Robert Karlicek comments, “Current technical and business issues involved with smart lighting, which refers to applications like human-centric lighting, visible light for wireless connectivity, or color tunability, were addressed for the first time during this exercise."
"The chapter provides a prioritized list of gaps and the technical approaches, both mainstream and early-stage, being pursued to overcome those challenges.”
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