Kulicke & Soffa, a Singapore based semiconductor equipment provider and Micro LED startup Rohinni have announced the launch of an advanced placement solution for Micro and Mini LED, PIXALUX™.

(Image: Kuliche & Soffa)

The two companies announced their development partnership in May. The joint development project has been focusing on the challenge of high-volume placement/mass transfer of LEDs. PIXALUX™ as a breakthrough combination of high-throughput and high-accuracy placement supporting extremely small-die applications was launched to bring a new level of competitiveness to the high-speed die placement market.

According to Kulicke & Soffa, PIXALUX™ can achieve high productivity and yield with ultrafast placement head design and accurate placement on multiple types of substrates while supporting placement of LED and IC dies.

Chan Pin Chong, Kulicke & Soffa’s Senior Vice President of Wedge Bond & EA/APMR Business Unit, said, “We are excited to announce PIXALUX™, an innovative cost-effective high speed mini LED placement solution. An example of one of the applications we anticipate PIXALUX™ initially enabling is the development of 2D LCD display backlighting which means thinner and lighter display products that will provide better performance, dynamic range (HDR) and efficiency, improving the overall experience of LCD displays for the consumer.”

Customer evaluations of the PIXALUX™ bonder will commence in October 2018.