Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced a full line-up of chip-scale LED packages* (CSP), including 0.6W-class and 3W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages.

Seoul Semiconductor Co., Ltd, the world-class LED manufacturer (www.seoulsemicon.com) announced that its Acrich MJT 5630D package, applicable to incandescent lamps, fluorescent lamps, and other lamps, have reached the world’s best luminous efficiency of 210 lm/W, which is the highest luminous efficiency set across the world for single LED package, and the package’s mass production has begun.

MLS INDIA, The LED package major has secured supplying LED chips worth one million USD to one of the most trusted brand in India. The products made of using MLS LEDs will be illuminating Indian homes very soon.

Philips Lumileds has announced new LUXEON Flip Chip LED devices that will enable the next generation of lighting applications by providing luminaire manufacturers with more design flexibility. Users can now access Philips Lumileds technology through a robust LUXEON Flip Chip die format giving them greater design options than in the past. “Now luminaire manufacturers can enjoy the best of both worlds, by either incorporating packaged LEDs as they did in the past, or by starting with the LED die and customizing the phosphor and packaging to best suit ...

HPLighting is proud to officially announce that HPLighting has passed LM80 testing with flying colors.  Both HPL H28 and C70 series packages have been approved by the LM-80 Energy Star Test -6000hrs under NOT 85 deg. Celsius but under the most critical criteria of 105 deg.Celsius testing environment and achieved 94.1% Lumen maintenance at BAY AREA COMPLIANCE LABORATORY CORP (BACL, USA), which is the highest LED testing standard facility worldwide. Most importantly, this official report endorses HPL H28/C70 ser...

New packaging system broadens array performance while reducing the cost of LED lighting LIVERMORE, CALIF., December 5, 2012 – Bridgelux, a developer and manufacturer of LED lighting technologies and solutions,  unveiled the Vero™ LED array, an innovative lighting platform that simplifies design integration and manufacturing and gives designers a more flexible LED lighting solution. The Vero next generation packaged array technology offers new advancements in design flexibility, ease of use, and energy efficiency today while also definin...

Osram Opto Semiconductors launches direct emitting green laser diodes Direct green diode lasers are an important step toward powerful pico projectors. It means that the old laborious way of producing green light by doubling the frequency of infrared laser is no longer needed. What’s more, the new technology enables high color rendering and excellent contrast to be achieved. The wavelength of the new PL 520 laser diode of 515-530 nm produces precisely the right green for projection applications. Its optical output is 50 mW and its eff...

Osram Opto Semiconductors announces the prototype of the Oslon Compact, currently the most compact high-power LED for the automotive market. Thanks to the flexible arrangement of these small LEDs it will be much easier and more cost-effective to create individual headlight designs. A prototype of the Oslon Compact LED was unveiled by the automotive semiconductor specialist from Regensburg in October at the SIA Vision conference in Versailles (France, October 9/10).

Edison Opto, a Taiwanese leading lighting manufacturer in high power LED market, has successively introduced many high power LED products which fit the market demand and environment protection. Edison Opto participates in many international exhibitions actively to showcase the latest LED products and the applications of Edison LDMS plan (Lighting Design Manufacturing Service). To maintain the leading position in the market, Edison Opto has recently introduced ET-3535 Series and broken the record for high cost-performance ratio products. Featuring excellen...