Most LED manufacturers were displaying UV or IR LED related applications at SPIE Photonics West, and many of these new applications covered LED chips, dies, package and other products.

High power LED package manufacturer Taiwan Semiconductor Lighting Corp. (TSLC) has just completed its new factory opening ceremony on Dec. 30, 2013. TSLC has inherited wafer level packaging LED silicon substrate and Aluminum Nitrade (AIN) package technology from high-power LED package manufacturer VisEra Technologies Company. The technology gives LED package components strong characteristics of narrow beam and heat dissipation.