A research institute and manufacturer based in southern China province Fujian have made a significant breakthrough in making small high power LEDs that can be driven at 1,000W, reported China Daily.

The rising trend of smaller high power individual components is becoming increasingly obvious. In theory, demands for smaller components to achieve higher optical density, high power, and good heat dissipation are conflicting. Package technology advancements try to juggle these factors in reality. Honglitronic General Manager Lei Lining believes LED flip chips are the solution to the contradicting properties.

May 27, 2014---The Chinese LED market has seen a rapid rise in demands. Expansion plans by several LED chip manufacturers boosted sapphire substrate demands. Sapphire substrate manufacturers are speeding up Chinese market strategies, due to high tariffs and emergence of Chinese LED chip manufacturers, according to the latest “2014 Global Sapphire Substrate Market Report” by LEDinside, a research division of TrendForce.

The rebounding LED lighting market spurred Chinese package manufacturers to expand in 2013, with expansions expected to be concentrated in 2014 as a result. But with chip production capacity expansion cycles taking much longer in comparison, subtle changes in the LED chip supply and demand relationship have occurred. With dispersed suppliers and chip prices more susceptible to price fluctuations, chip manufacturers have been unable to greatly raise prices leading to intensified chip shortages.