2014-06-06

Molex Releases Plastic Substrate Interconnect for LED COB Array Holders

 Molex Incorporated continues to be a leader in the Solid State Lighting (SSL) interconnect field with the addition of its Plastic Substrate Interconnect (PSI) for LED Chip-on-Board (COB) Arrays. These customizable interconnects feature a low-profile harness interface that delivers power to the array through a simple and reliable connection to a holder, or plastic substrate. With a low overall package height of ~2.00mm, Molex PSI provides a slim design for space-limited applications while minimizing substrate costs. By employing the Pico-EZmate™ harness system, the solution integrates the electrical and mechanical features with the array for a simple, solderless connection.
Continue reading
Samsung Electronics America today announced a partnership with the Georgia Theatre Company and its channel partner, GDC Technology America, to deliver an enhanced moviegoing experience at Trilith Cinemas in Fayetteville, Georgia. Trilith Cinem... READ MORE
Samsung is bringing Galaxy AI to life on the big screen in some of the world’s most iconic urban spaces through a global 3D video billboard experience. Ahead of Galaxy Unpacked on Feb. 25, Samsung is giving audiences around the world ... READ MORE