Alpha, a global leading materials supplier, introduces a new preform product into the market, to improve assembly yield when using large BGA devices. The product also has usability by enabling reflow soldering of some types of through-hole devices, making it a truly versatile offering.  Named for their precise height control and burr free edges, these non-collapse disc spacers mitigate corner solder bridging caused by BGA warping during SMT reflow.  The spacer blocks are offered in tape and reel packaging for automatic placement with excellent pick rate yield.