2014-11-11

Plessey expands with Chip Scale Packages and Wafer Level Packaging

Plessey today announced its expansion into Chip Scale Packages and Wafer Level Packaging solutions leading to its Application Specific LED - the AS-LED™.  Recent performance improvements have elevated Plessey's award winning GaN-on-Silicon technology MaGIC™ LEDs to be competitive with any LED technology with improvements in key critical areas including lumens/watt, elevatingGaN-on-Silicon above existing LED technology.
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The CLEDIA project, co-financed by the Auvergne-Rhône-Alpes A group of logos with different names AI-generated content may be incorrect. Region and Bpifrance has just been completed after three years of collaborative innovation between P... READ MORE

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