2014-11-11

Plessey expands with Chip Scale Packages and Wafer Level Packaging

Plessey today announced its expansion into Chip Scale Packages and Wafer Level Packaging solutions leading to its Application Specific LED - the AS-LED™.  Recent performance improvements have elevated Plessey's award winning GaN-on-Silicon technology MaGIC™ LEDs to be competitive with any LED technology with improvements in key critical areas including lumens/watt, elevatingGaN-on-Silicon above existing LED technology.
Continue reading
  Seoul Semiconductor, Seoul Viosys CES 2025 Exhibition Booth Global optoelectronics leader Seoul Semiconductor and Seoul Viosys (hereafter, "Seoul") participated in CES 2025, held in Las Vegas, USA, from January 7 to 10, 2024. ... READ MORE

In automotive lighting, achieving precise RGB LED color calibration can be a real challenge. Automotive lighting engineers or designers often face time-consuming, intricate processes to ensure that RGB LEDs display accurate colors under differ... READ MORE