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2014-11-11

Plessey expands with Chip Scale Packages and Wafer Level Packaging

Plessey today announced its expansion into Chip Scale Packages and Wafer Level Packaging solutions leading to its Application Specific LED - the AS-LED™.  Recent performance improvements have elevated Plessey's award winning GaN-on-Silicon technology MaGIC™ LEDs to be competitive with any LED technology with improvements in key critical areas including lumens/watt, elevatingGaN-on-Silicon above existing LED technology.
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FEATURED PRODUCTS
Violumas Boosts 275nm and 265nm Output in Next Generation UVC LEDs

Violumas, provider of high-power UV LED solutions and inventor of 3-PAD LED technology, is proud to launch the release of new 275nm and 265nm LEDs in mid-power, high-power, and high-density packages. The radiant flux of the new 275nm and 265nm... READ MORE

Cree LED Introduces CV28D LEDs with Groundbreaking FusionBeam Technology for LED Signs and Displays

DURHAM, NC – November 12, 2024 –– Cree LED, a Penguin Solutions brand (Nasdaq: PENG), today announced the launch of its new CV28D LEDs with FusionBeam™ Technology, a groundbreaking advancement for the LED signage market... READ MORE

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