2014-11-11

Plessey expands with Chip Scale Packages and Wafer Level Packaging

Plessey today announced its expansion into Chip Scale Packages and Wafer Level Packaging solutions leading to its Application Specific LED - the AS-LED™.  Recent performance improvements have elevated Plessey's award winning GaN-on-Silicon technology MaGIC™ LEDs to be competitive with any LED technology with improvements in key critical areas including lumens/watt, elevatingGaN-on-Silicon above existing LED technology.
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France-based car maker Peugeot unveiled a new concept car, the Peugeot RCZ Vision, building on the company's 2009-2015 RCZ coupe - with a host of new technologies. The RCZ Vision, build on Stellantis' STLA One architecture, is an ele... READ MORE