2014-12-18

Bergquist New Room Temperature Cure Epoxy Eliminates the Need for Mechanical Fasteners

The Bergquist Company is proud to introduce its latest product in our Liqui-Bond® family – Liqui-Bond® EA 1805. Sporting a Thermal Conductivity of 1.8 W/m-K, our new Liqui-Bond® EA 1805 is a two-component, epoxy based, liquid dispensable adhesive that cures at room temperature with a high bond strength that can be accelerated with additional heat. Having a high bond strength eliminates the need for fasteners and maintains a structural bond even in severe environments.
Continue reading

microLEDs: from headlamps to the data center When we think about the evolution of AI technology, developments in machine learning and large language models come readily to mind, as do the latest graphics processing units (GPUs), high-bandwidth... READ MORE

The question of what makes a building "smart" has been debated in the industry for years. ams OSRAM provided a clear answer at Light + Building 2026: it is light — not as illumination, but as a sensory nervous system. It percei... READ MORE