2015-01-13

What are the Real COB, Flip Chip and Vapor Chamber Technology?

What is “Vapor Chamber” Vapor Chambers provide far superior thermal performance than traditional solid metal Heat spreaders at reduced weight and height. Thermal spread resistance is almost neglectable and thermal resistance is x times lower than (refer to copper, carbon nanotube compound, nano diamond compound). Vapor Chambers enable higher component heat densities and TDPs(Thermal Design Power) at safe operating temperatures, extending the components and products life.
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Making the Invisible Visible: IR:6 Sets New Standards in Infrared Technology Infrared light, though invisible to the human eye, is crucial for many modern technologies. IR:6 introduces a true innovation that enhances performance, efficiency, ... READ MORE

In January 2025, certain automotive LEDs manufactured by Malaysia-based LED manufacturer Dominant Opto Technologies Sdn. Bhd. ("Dominant") were recalled from a distributor pursuant to a patent infringement lawsuit filed by Nichia Cor... READ MORE