2015-01-13

What are the Real COB, Flip Chip and Vapor Chamber Technology?

What is “Vapor Chamber” Vapor Chambers provide far superior thermal performance than traditional solid metal Heat spreaders at reduced weight and height. Thermal spread resistance is almost neglectable and thermal resistance is x times lower than (refer to copper, carbon nanotube compound, nano diamond compound). Vapor Chambers enable higher component heat densities and TDPs(Thermal Design Power) at safe operating temperatures, extending the components and products life.
Continue reading
ams OSRAM’s OSIRE® E3731i and Stand-Alone Intelligent Driver (SAID) use OSP license-free protocol to connect color LEDs, sensors and microcontrollers. ams OSRAM, a global leader in intelligent emitting and sensing technologies, will... READ MORE

JBD, a pioneering MicroLED display manufacturer, has set a new standard with its Phoenix series microdisplay, achieving an industry-record white-balanced brightness of 2 million nits. JBD’s Phoenix - Native Monolithic RGB Panel Leveragin... READ MORE