2015-04-16

TI New DLP Chipset for HUDs Enables Wider LED Applications

Texas Instruments (TI) (NASDAQ: TXN) today introduced the first DLP® chipset engineered and qualified for automotive head-up display (HUD) applications. Combining the award-winning imaging qualities of DLP technology with automotive reliability, the new chipset enables head-up displays with the industry's widest field of view (FOV) up to 12 degrees. It also enables high brightness, color and contrast levels and provides manufacturers with a scalable platform. For more information, seewww.ti.com/headupdisplay.
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