Texas Instruments (TI) (NASDAQ: TXN) today introduced the first DLP® chipset engineered and qualified for automotive head-up display (HUD) applications. Combining the award-winning imaging qualities of DLP technology with automotive reliability, the new chipset enables head-up displays with the industry's widest field of view (FOV) up to 12 degrees. It also enables high brightness, color and contrast levels and provides manufacturers with a scalable platform. For more information, seewww.ti.com/headupdisplay.