2016-10-21

CEA LETI Looks into 3D GaN Nanowires for Ultra Bright LED Lighting

Grenoble-based research institute CEA LETI (LETI) recently shared with LEDinside how it is transforming nanowire technology first designed for transistors into making ultra-bright LEDs.
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2015-06-18

Bridgexlux: Technology Advancements Drive Next Generation Innovative Lighting

For manufacturers to succeed in the LED market, using standardized components and increasing LED product efficacy and C/P ratio is important in ensuring products can meet client demands, said Andy Man, Vice President, Asia, Bridgelux at LEDforum 2015 in Guangzhou, China. Main organizers of the forum that took place on June 11, 2015 include LEDinside, CNLEDw.com, and Guangzhou Guangya Messe Frankfurt.
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2015-05-06

Samsung Electronics Unveils Ultra-Compact LED Chip Scale Packaging Technology at LIGHTFAIR International 2015

Samsung Electronics, a world leader in advanced component solutions, today introduced advanced chip scale packaging (CSP) technology for use in a diversity of LED lighting applications at LIGHTFAIR International 2015, being held in New York, May 5-7.
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This year's report plays a key role in aligning with the upcoming standards of the European Union and is built on a significantly broader data foundation than in previous years. For the first time, the report includes all LEDVANCE entities... READ MORE

Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LEDs, is pleased to announce that Cube Direct Mountable Chip received the LightFair Innovation Awards in the LED Chips & Modules category. ... READ MORE