2015-06-22

Dow Corning: CSP LED to Drive Next Generation LED Package Development

CSP technology will lead the emergence of new LED package material demands, said Kaz Maruyama, Global Marketing Director, Dow Corning Lighting Solutions at LEDforum 2015 Guangzhou, which took place earlier this month at China Import and Export Fair Pazhou Complex in Guangzhou, China.
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A tiny Chip LED from ams OSRAM offers higher brightness, making it simply ideal for integration into everyday devices such as in-ear headphones or smart rings The enhanced Chip LED from ams OSRAM delivers higher brightness—while taking u... READ MORE

Introducing the XLamp® XP-LR & XP-GR Round LES LEDs Cree LED is redefining beam performance in portable lighting with the launch of the XLamp® XP-LR and XP-GR LEDs – designed specifically for directional lighting application... READ MORE