2015-12-23

Veeco Wins Several Advanced Packaging System Orders from a Leading Asian Foundry

Veeco Instruments announced today that it has received multiple orders from a leading foundry in Asia for its Precision Surface Processing (PSP) WaferStorm™ system.  The WaferStorm platform provides wafer processing solutions for advanced packaging applications.
Continue reading
Silanna UV, a global innovator in ultraviolet semiconductor technology, today announced the release of an additional package type: a TO-39 flat window package for its high-performance SF1 series (Far-UVC 235 nm) and SN3 series (Deep-UVC 255 nm) L... READ MORE

Ennostar, a leading vertically integrated optoelectronic semiconductor company, will showcase its latest Micro LED optical communication innovations at Touch Taiwan 2026, in collaboration with AUO Corporation and Tyntek Corporation. In additio... READ MORE