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2016-04-18

MechaTronix: LED Chip Designs Spur More Efficient Heat Sink Designs in High Power Applications

Miniaturization and rising efficiency in LED chip designs has initiated redesigns in heat sinks, which are becoming more compact and turning to new designs to achieve faster thermal dissipation, said MechaTronix General Manager Koen Vangorp during an interview with LEDinside at Taiwan International Lighting Show 2016 (TILS) that took place recently in Nangang Exhibition Hall, Taipei.
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Violumas Boosts 275nm and 265nm Output in Next Generation UVC LEDs

Violumas, provider of high-power UV LED solutions and inventor of 3-PAD LED technology, is proud to launch the release of new 275nm and 265nm LEDs in mid-power, high-power, and high-density packages. The radiant flux of the new 275nm and 265nm... READ MORE

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